Postdoctoral Fellow: Metrology for Semiconductor Packaging

Johns Hopkins University; Gaithersburg (MD); On-site; USD 70,000 - 89,000; Full time

Benefits offered by this job

Comprehensive rewards package

Job summary

The Chronicle Of Higher Education, Inc. is seeking a Pre-Professional Research Experience (PREP) Research Associate for a CHIPS funded project at Johns Hopkins University. This position involves supporting scientific research related to semiconductor advanced packaging. The ideal candidate will have a PhD and significant experience in semiconductor device fabrication and characterization techniques. The benefits include a comprehensive rewards package to support health, life, and career development.

Qualifications

• PhD in physics, electrical engineering, materials science, or a related field required.
• Experience in semiconductor device fabrication essential.
• Proficiency in programming languages such as Python, Java, or MATLAB.

Responsibilities

• Fabricate Si, SiO₂, and SiN chips for experiments.
• Optimize fabrication processes, including cleaning protocols.
• Perform surface characterization of chips for bonding experiments.
• Coordination with teams on materials characterization and modeling.

Skills

Semiconductor device fabrication

Programming with Python

Communication skills

Teamwork

Education

PhD in physics, electrical engineering, materials science

Tools

AFM

SEM

Optical microscopy

Lithography techniques

Job description

The Chronicle Of Higher Education, Inc. is seeking a Pre-Professional Research Experience (PREP) Research Associate for a CHIPS funded project at Johns Hopkins University. This position involves supporting scientific research related to semiconductor advanced packaging. The ideal candidate will have a PhD and significant experience in semiconductor device fabrication and characterization techniques. The benefits include a comprehensive rewards package to support health, life, and career development.