Postdoc: Metrology & Bonding for Advanced Packaging

Johns Hopkins University; Baltimore (MD); On-site; USD 70,000 - 90,000; Full time

Job summary

Johns Hopkins University is seeking a PREP Research Associate in Baltimore to advance measurement science for semiconductor advanced packaging. This position will involve designing tests for evaluating bond quality and requires a PhD in a relevant field.

The ideal candidate will have experience with wafer bonding processes and proficiency in finite element modeling. Strong communication skills and the ability to work in a team are essential for success in this role.

Qualifications

• PhD required in relevant fields.
• Experience with wafer and/or hybrid chip bonding processes.
• Proficiency in finite element modeling and CAD tools.
• Familiarity with custom infrared microscopy setups.
• US citizenship strongly preferred.

Responsibilities

• Design and model test methods for evaluating bond quality.
• Create test rigs for bond strength measurement.
• Perform testing at cryogenic and high temperatures.
• Coordinate with teams on materials and surface characterization.

Skills

Finite element modeling

Programming (Python, Java, Matlab)

CAD proficiency (SolidWorks, Autodesk)

Experience with wafer/hybrid chip bonding

Excellent communication skills

Education

PhD in mechanical engineering, physics, electrical engineering, materials science

Tools

COMSOL

ANSYS

Job description

Johns Hopkins University is seeking a PREP Research Associate in Baltimore to advance measurement science for semiconductor advanced packaging. This position will involve designing tests for evaluating bond quality and requires a PhD in a relevant field.

The ideal candidate will have experience with wafer bonding processes and proficiency in finite element modeling. Strong communication skills and the ability to work in a team are essential for success in this role.