Physical Design Engineer

Broadcom Inc.; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical/Dental/Vision

401K match

ESPP

EAP

Paid holidays

Sick leave & vacation

Family leave

Discretionary bonus

Equity awards

Job summary

Broadcom Inc. is seeking a design engineer with physical layout skills to advance next-generation ASIC products, emphasizing parallel interfaces and advanced interconnects.

You will collaborate with R&D, IP development, customers, and manufacturing partners to drive innovative 2.5D and 3D packaging solutions. The role combines layout, electrical analysis, and automation to optimize high-speed interfaces across multiple projects, involving a mix of customer work and internal development with

Qualifications

• Bachelor's or higher in Electrical Engineering or Computer Science with extensive layout knowledge.
• 12+ years relevant experience for Bachelors, 10+ for Masters.
• Experience with 2.5D/3D IC interconnects and high-speed layouts.

Responsibilities

• Design implementation and physical layout of power grids, 2.5D and 3D die-die interconnects.
• Perform DRC, LVS, and electrical checks.
• Automate repetitive design steps via scripting.
• Develop high-speed signal interconnects with SI/PI teams.
• Analyze and optimize ubump and RDL patterns.
• Explore new 2.5D/3D interconnect technologies.

Skills

TCL scripting

Python scripting

Cross-functional

Independent/self-starter

Time management

Education

Bachelor's degree in Electrical Engineering or Computer Science

Master's degree in Electrical Engineering or Computer Science

Tools

IC/PCB layout tools

Job description

Job Description

The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects. We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners. This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities

• Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.
• DRC, LVS, and electrical checking.
• Ability to automate common processes and design steps.
• Development of high-speed signal interconnects working alongside SI and PI engineers.
• Electrical analysis and optimization of ubump and RDL patterns.
• Evaluation and development of new 2.5D and 3D interconnect technologies.
• Technology and testchip roadmapping with a focus on advanced packaging.

Skills and Experience

• Independent, self-starter who can work across a worldwide organization and customer base.
• Ability to manage multiple concurrent customers under short timelines.
• Comfort with providing guidance and direction with incomplete information.
• Experience with various IC, Package and PCB layout databases and tools.
• Strong TCL, Python scripting experience to automate routine tasks.
• Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00.

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time
• Paid Family Leave and other leaves of absence
• discretionary annual bonus
• competitive new hire equity grant
• annual equity awards

Broadcom is proud to be an equal opportunity employer.

We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.

We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series.

Follow us on Linked In Broadcom Inc.