Physical Design Engineer

Socket.dev; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Discretionary bonus

Equity grant

Annual equity awards

401(k) matching

ESPP

Job summary

Broadcom is seeking a design engineer with strong physical layout skills to develop next-generation ASIC products focusing on parallel interfaces. You will work on customer products and R&D for 2.5D/3D ICs, collaborating across R&D, IP, customers, and manufacturing partners.

You will design power grids, 2.5D/3D interconnects, automate steps with TCL/Python, and contribute to technology roadmaps and testchips for advanced packaging.

Qualifications

• Bachelor's or Master's with >10 years in design layout for ICs/packaging, with strong electrical background.
• Experience with 2.5D/3D ICs, interconnects, and high-speed layouts.
• Ability to automate design steps and scripts to improve efficiency.

Responsibilities

• Design implementation and physical layout of power grids, 2.5D and 3D die-die interconnects.
• Perform DRC, LVS, and electrical checks.
• Automate routine design tasks and processes.
• Develop high-speed signal interconnects with SI/PI engineers.
• Analyze and optimize ubump and RDL patterns.
• Evaluate new 2.5D/3D interconnect technologies.
• Roadmap technology and tests for advanced packaging.

Skills

TCL scripting

Python scripting

Independent worker

Multi-site coordination

Customer mgmt

Education

Bachelor's degree in Electrical Engineering or CS and 12+ years

Master's degree in Electrical Engineering or CS and 10+ years

Tools

IC/Package/PCB databases

Job description

Job Description:

The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.

We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners.

This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities:

• Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.

• DRC, LVS, and electrical checking.

• Ability to automate common processes and design steps.

• Development of high-speed signal interconnects working alongside SI and PI engineers.

• Electrical analysis and optimization of ubump and RDL patterns.

• Evaluation and development of new 2.5D and 3D interconnect technologies.

• Technology and testchip roadmapping with a focus on advanced packaging.

Skills and Experience:

• Independent, self-starter who can work across a worldwide organization and customer base.

• Ability to manage multiple concurrent customers under short timelines.

• Comfort with providing guidance and direction with incomplete information.

• Experience with various IC, Package and PCB layout databases and tools.

• Strong TCL, Python scripting experience to automate routine tasks.

• Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.

Compensation and Benefits

The annual base salary range for this position is USD 143,800.00 To USD 230,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.