Physical Design Engineer

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grant

Annual equity awards

Medical, dental and vision plans

401(k) with company match

ESPP

Job summary

Broadcom is seeking a design engineer focused on physical layout to advance next-generation ASIC products with emphasis on parallel interfaces. You will collaborate across R&D, IP development, customers and manufacturing partners to deliver innovative 2.5D/3D interconnect solutions.

The role requires an electrical engineering background, strong scripting in TCL/Python, and the ability to guide projects across a global organization while meeting tight timelines.

Qualifications

• 12+ years experience in electrical engineering or 10+ years with a Master’s degree.
• Strong background in ASIC layout, interconnects and high-speed signaling.
• Familiarity with 2.5D/3D interconnect technologies and testchip roadmapping.

Responsibilities

• Design implementation and physical layout of power grids and interconnects.
• Perform DRC/LVS checks and optimize electrical performance.
• Automate design steps with scripting.
• Develop high-speed interconnects with SI/PI teams.
• Analyze ubump/RDL patterns and optimize layouts.
• Explore new 2.5D/3D interconnect technologies.
• Contribute to technology and testchip roadmaps with focus on packaging.

Skills

Independent worker

Multitasking

Guidance & leadership

Layout databases/tools

TCL scripting

Python scripting

Education

Bachelor's degree in Electrical Engineering or Computer Science

Master's degree in Electrical Engineering or Computer Science

Tools

IC/PCB/Package layout tools

Job description

Job Description: The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects.

Job Description: The ASIC Products Division at Broadcom has developed some of the most complex IC solutions and technologies over the last two decades. Our products power the internet in areas such as machine learning, cloud computing, wireless infrastructure, and networking. We develop some of the most advanced technologies in the industry encompassing 3D and 2.5D interconnects. We are seeking a design engineer with physical layout skills to develop our next generation products with a focus on parallel interfaces. The job requires aspects of a successful layout engineer, an electrical background, a strong interest in 2.5D and 3D IC development, and new technology pathfinding. The candidate will work on a mix of customer products and development of new interconnect technologies and IP for MCM, 2.5D, and 3D ICs, working alongside R&D, IP development, customers, and manufacturing partners. This is an exciting opportunity to develop new ideas, design the next generation of leading edge ASIC products, and work on the most advanced technologies in the industry.

Responsibilities

• Design implementation and physical layout implementation of power grids, 2.5D and 3D die-die interconnects.
• DRC, LVS, and electrical checking.
• Ability to automate common processes and design steps.
• Development of high-speed signal interconnects working alongside SI and PI engineers.
• Electrical analysis and optimization of ubump and RDL patterns.
• Evaluation and development of new 2.5D and 3D interconnect technologies.
• Technology and testchip roadmapping with a focus on advanced packaging.

Skills and Experience

• Independent, self-starter who can work across a worldwide organization and customer base.
• Ability to manage multiple concurrent customers under short timelines.
• Comfort with providing guidance and direction with incomplete information.
• Experience with various IC, Package and PCB layout databases and tools.
• Strong TCL, Python scripting experience to automate routine tasks.
• Bachelor's degree in Electrical Engineering or Computer Science and 12+ years related work experience; or a Master's degree in Electrical Engineering or Computer Science and 10+ years related work experience.

Compensation And Benefits

• The annual base salary range for this position is USD 143,800.00 To USD 230,000.00
• As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.
• Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
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