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Intel Corporation in Hillsboro, Oregon is seeking a Module Engineering Intern to support high-volume manufacturing of leading-edge semiconductor technologies. You will work with engineers, technicians, and operations teams on a meaningful project and participate in day-to-day manufacturing activities.
Applicants should be pursuing a PhD in a technical field, have a minimum GPA of 3.0, and be available for a 10–12 week onsite internship.
Intel Corporation in Hillsboro, Oregon is seeking a Module Engineering Intern to support high-volume manufacturing of leading-edge semiconductor technologies. You will work with engineers, technicians, and operations teams on a meaningful project and participate in day-to-day manufacturing activities.
Applicants should be pursuing a PhD in a technical field, have a minimum GPA of 3.0, and be available for a 10–12 week onsite internship.