Module Engineering PhD Intern

Intel Corporation

Hillsboro (OR)

On-site

USD 121,000 - 122,000

Full time

4 days ago
Be an early applicant
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Benefits offered by this job

Stock bonuses
Health benefits
Retirement plan
Paid vacation

Job summary

Intel Corporation in Hillsboro, Oregon seeks a Module Engineering PhD Intern to contribute to development, optimization, and implementation of advanced semiconductor manufacturing processes. You will troubleshoot, sustain, and qualify equipment to improve yield and reliability.

Work with cross‑functional teams on process control, analyze data, and drive manufacturing excellence in a high‑volume environment.

Qualifications

  • Pursuing a PhD in Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related STEM discipline.
  • 3+ months of hands-on experience through research, laboratory work, internships, academic projects, or industry experience.
  • Fundamental understanding of semiconductor manufacturing processes, process engineering, or advanced manufacturing methodologies.
  • Strong analytical, problem-solving, and technical communication skills.

Responsibilities

  • Support the development, optimization, and implementation of manufacturing processes for semiconductor production modules.
  • Troubleshoot, sustain, and qualify manufacturing equipment to improve performance, reliability, and operational efficiency.
  • Partner with cross-functional engineering teams to develop and enhance process control methodologies.
  • Analyze process and equipment data to identify improvement opportunities and drive manufacturing excellence.
  • Execute technical projects focused on equipment performance, process optimization, and yield enhancement.
  • Apply engineering principles and research methodologies to solve complex manufacturing challenges and develop innovative solutions.
  • Contribute to initiatives that improve safety, quality, productivity, and operational effectiveness.

Skills

Analytical skills
Problem solving
Technical communication

Education

PhD student in Engineering or related STEM

Job description

Job Details: Job Description

As a Module Engineering PhD Intern, you will contribute to the development, optimization, and implementation of advanced manufacturing processes within semiconductor production. In this role, you will work closely with experienced engineers to troubleshoot, sustain, and qualify manufacturing equipment while supporting process improvements that enhance operational performance, yield, and reliability. This internship offers a unique opportunity to apply cutting-edge research and technical expertise in a high-volume manufacturing environment, gain hands-on industry experience, and make meaningful contributions to technology that powers the world. Business Group Intel Foundry is at the forefront of semiconductor manufacturing innovation, delivering world-class process technologies and manufacturing solutions. The organization is focused on driving operational excellence, advancing manufacturing capabilities, and enabling the production of industry-leading semiconductor products. As part of Intel Foundry, you will collaborate with talented engineers and researchers who are shaping the future of technology through innovation, continuous improvement, and engineering excellence.

Key Responsibilities
  • Support the development, optimization, and implementation of manufacturing processes for semiconductor production modules.
  • Troubleshoot, sustain, and qualify manufacturing equipment to improve performance, reliability, and operational efficiency.
  • Partner with cross-functional engineering teams to develop and enhance process control methodologies.
  • Analyze process and equipment data to identify improvement opportunities and drive manufacturing excellence.
  • Execute technical projects focused on equipment performance, process optimization, and yield enhancement.
  • Apply engineering principles and research methodologies to solve complex manufacturing challenges and develop innovative solutions.
  • Contribute to initiatives that improve safety, quality, productivity, and operational effectiveness.
Minimum Qualifications
  • Currently pursuing a PhD degree in Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Mechanical Engineering, Chemical Engineering, or a related STEM discipline.
  • 3+ months of hands-on experience through research, laboratory work, internships, academic projects, or industry experience.
  • Fundamental understanding of semiconductor manufacturing processes, process engineering, or advanced manufacturing methodologies.
  • Strong analytical, problem-solving, and technical communication skills.
Preferred Qualifications
  • Research experience in semiconductor device fabrication, process development, materials engineering, or manufacturing technologies.
  • Experience working with process characterization, statistical analysis, data analytics, or experimental design methodologies.
  • Hands-on experience operating, troubleshooting, and maintaining complex equipment and hardware systems.
  • Strong academic performance with a cumulative GPA of 3.0 or higher preferred.
  • Knowledge of semiconductor manufacturing equipment, process control systems, and equipment qualification techniques.
  • Demonstrated ability to work effectively in cross-functional and collaborative engineering environments.
  • Proven ability to take initiative, solve complex technical problems, and deliver results in a fast‑paced setting.

Job Type: Student / Intern

Shift: Shift 1 (United States of America)

Primary Location: US, Oregon, Hillsboro

Additional Locations:

Position of Trust N/A

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry.

It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US:

$120,898.00-120,902.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.

Our standard internship rates are based on your degree, location, and the job role.

Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will require an on-site presence.

* Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Module Engineering PhD Intern - Wet Etch
Module Engineering PhD Intern - Wet Etch

Intel Corporation • Hillsboro (OR)

On-site
USD 121,000 - 122,000
Module Engineering PhD Intern 2027
Module Engineering PhD Intern 2027

Intel Corporation • Hillsboro (OR)

On-site
USD 121,000 - 122,000
Module Engineering PhD Intern 2027
Module Engineering PhD Intern 2027

Intel • Hillsboro (OR)

On-site
USD 121,000 - 122,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineering PhD Intern New 2027
Module Engineering PhD Intern New 2027

Intel Corporation • Hillsboro (OR)

On-site
USD 121,000 - 122,000
Health benefits
Stock bonuses
Retirement plan
+1
Module Engineering PhD Intern
Module Engineering PhD Intern

Intel Corporation • Chandler (AZ)

On-site
USD 121,000 - 122,000
Module Development Engineer
Module Development Engineer

Intel • Hillsboro (OR)

On-site
USD 133,800 - 188,890
Module Engineer
Module Engineer

Intel • Hillsboro (OR)

On-site
USD 144,000 - 171,000
Competitive pay
Stock bonuses
Health benefits
+1
Software Research Engineering - (PhD Intern)
Software Research Engineering - (PhD Intern)

Intel Corporation • Hillsboro (OR)

On-site
USD 150,000 - 151,000
Competitive pay
Stock bonuses
Health benefits
+2
Module Engineering - Day Shift 5 or 7
Module Engineering - Day Shift 5 or 7

Intel • Phoenix (AZ)

On-site
USD 85,000 - 163,000
Intel Process Integration Engineer - (BE)
Intel Process Integration Engineer - (BE)

Intel Corporation • Phoenix (AZ)

On-site
USD 104,000 - 199,000
Stock bonuses
Stock awards
Excellent medical plans
+2