Thermal Quality and Reliability Engineer

Intel; Phoenix (AZ); On-site; USD 120,860 - 170,630; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid time off

Job summary

Intel is seeking a Packaging Quality and Reliability Engineer to drive quality standards for packaging components across development and manufacturing. You will shape reliability models, analyze failure data, and influence decisions that ensure product readiness.

You will collaborate with internal teams and external partners to meet milestones, define metrology strategies, and drive standardization across qualifications and processes.

Qualifications

• PhD required with semiconductor packaging exposure and failure‑mode understanding.
• Experience with reliability and quality across packaging processes is preferred.

Responsibilities

• Develop and maintain quality and reliability standards for packaging components, including inspection and testing mechanisms.
• Evaluate materials, processes, and techniques to ensure compliance with requirements.
• Define metrology strategies to capture quality parameters across packaging modules.
• Develop equipment to evaluate silicon and packaging under simulated field conditions.
• Analyze reliability data to identify risk areas and provide process improvement insights.
• Develop reliability models via statistical analysis to assess risks and failure impacts.
• Innovate acceleration techniques and quality screens for new packaging processes.
• Drive standardization in qualification, manufacturing quality systems, and methods.
• Collaborate with internal teams and external partners to meet milestones and reduce risks.
• Respond to quality excursions and provide recommendations to improve reliability.

Skills

Statistical analysis

DOE principles

Reliability modeling

Python/SQL

8D problem solving

Cross-functional leadership

Package technologies (BGA, wafer-level

Education

PhD in engineering/science

Tools

Statistical tools

Analytical lab techniques

Job description

Job Details

As a Packaging Quality and Reliability Engineer, you will play a critical role in Intel's mission to deliver world‑class semiconductor technologies. In this position, you will drive quality and reliability standards for cutting‑edge packaging components, ensuring they meet the stringent requirements of our products and production environments. This dynamic role bridges technology development and manufacturing, empowering you to make impactful contributions to Intel's product development milestones and long‑term customer satisfaction. You will collaborate with diverse cross‑functional teams, influence key decision‑making processes, and innovate reliability models to shape the future of Intel's packaging technologies.

Key Responsibilities

• Develop and maintain quality and reliability standards for packaging components, including defining inspection and testing mechanisms, conducting quality assessments, and performing statistical analyses.
• Evaluate materials, processes, and techniques used in production to ensure compliance with product and system‑level requirements.
• Define metrology strategies to ensure comprehensive quality parameters are captured across modules for packaging.
• Develop and sustain equipment to evaluate silicon and packaging technologies under simulated field conditions, such as heat, humidity, and temperature variations.
• Analyze quality and wear‑out reliability data to identify potential risk areas and provide actionable insights for process improvement.
• Develop reliability models by performing statistical analysis to categorize failure impacts and assess risks in meeting customer specifications.
• Innovate new acceleration techniques, analytical tools, and quality screens to ensure early identification of potential issues with new packaging processes.
• Drive standardization in product qualification, manufacturing quality systems, and methods, enabling continuous improvement in quality and reliability practices.
• Collaborate with internal teams and external partners to ensure packaging process maturity, reduce risks, and meet product milestones.
• Respond to quality excursions, troubleshoot issues, and provide recommendations to improve product reliability and specifications.

Qualifications

Minimum Qualifications

• PhD degree in Mechanical Engineering, Materials Science, Physics, Chemistry, Electrical Engineering, Aerospace Engineering, or a related field with at least 6 months of experience in semiconductor packaging, assembly processes, and understanding of failure modes and mechanisms.

Preferred Qualifications

• Proficiency in statistical process control, reliability modeling, and statistical data analysis.
• Knowledge of design of experiments (DOE) principles and data analytics tools.
• Experience with package technologies such as Ball Grid Array (BGA) or wafer‑level manufacturing.
• Familiarity with advanced analytical lab techniques like acoustic imaging, SEM, EDX, FTIR, or mechanical testing.
• Programming or scripting experience for data analysis using Python, SQL, or similar tools.
• Proven ability to lead and influence cross‑functional teams to achieve strategic goals.
• Strong problem‑solving skills and experience with methodologies like 8D and 5 Whys.

Join Intel's innovative engineering community and help us create technologies that will shape the future. Together, we can achieve extraordinary results.

Job Type

College Grad

Shift

Shift 1 (United States of America)

Primary Location

US, Arizona, Phoenix

Business Group

Intel Foundry strives to make every facet of semiconductor manufacturing state‑of‑the‑art while delighting our customers -- from delivering cutting‑edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $120,860.00 - 170,630.00 USD. The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on‑site presence. Job posting details (such as work model, location or time type) are subject to change.

Additional Information

Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.