Packaging Program Lead - APTM & Advanced Packaging

Intel; Phoenix (AZ); On-site; USD 120,320 - 236,810; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Vacation

Job summary

Intel Foundry is seeking a seasoned program leader to drive cross-functional initiatives across APTM manufacturing quality systems, phase gate readiness, and supplier quality improvements. You will guide complex plans through planning, testing, documentation, training, and close-out, while maintaining disciplined execution and clear communication with stakeholders.

You will collaborate with assembly, packaging, test, and manufacturing operations to ensure readiness, ownership clarity, and

Qualifications

• 7+ years of experience in packaging technology, manufacturing, quality, engineering, operations, or project/program management environments.
• Ability to lead through influence across multiple stakeholder organizations.
• Experience with phase gate execution and quality systems is preferred.

Responsibilities

• Lead cross-functional programs supporting APTM manufacturing quality systems and phase gate readiness.
• Build and manage project plans aligned to objectives, timelines, resources, and risks.
• Drive execution discipline, track schedule, cost, risks, and readiness across teams.

Skills

Program management

Cross-functional collaboration

Stakeholder management

Risk management

Communication

Education

Bachelor's degree in engineering

Master's degree in engineering/related discipline

Job description

Intel Foundry is seeking a seasoned program leader to drive cross-functional initiatives across APTM manufacturing quality systems, phase gate readiness, and supplier quality improvements. You will guide complex plans through planning, testing, documentation, training, and close-out, while maintaining disciplined execution and clear communication with stakeholders.

You will collaborate with assembly, packaging, test, and manufacturing operations to ensure readiness, ownership clarity, and