Packaging Module Engineer - DOE, SPC & Reliability

Intel Corporation; Phoenix, Northern (AZ, KY); Hybrid; USD 115,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health insurance

Retirement plan

Paid vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to design and optimize assembly processes and equipment, improving quality, reliability, cost, yield and manufacturability across the packaging stack.

You will apply DOE and SPC methods, validate new techniques, and work with cross-functional teams to address packaging challenges and advance Intel's technology roadmap.

Qualifications

• Bachelor’s or Master’s degree in a related engineering field with relevant experience.
• Experience with equipment adjustment, process characterization, and manufacturability.
• Knowledge of DOE and SPC methods and data-driven decision making.

Responsibilities

• Develop and optimize assembly processes and equipment to meet quality, reliability, cost and yield goals.
• Apply DOE and SPC principles to refine processes and document improvements.
• Design and maintain equipment to evaluate silicon and packaging technologies under simulated field conditions.
• Ensure manufacturability of layouts and oversee manufacturing workflows.
• Collaborate with supply chain and vendor quality to meet performance standards.
• Innovate techniques, tools, and quality screens to address packaging reliability challenges.
• Lead problem-solving initiatives and drive continuous improvements across processes and equipment.
• Provide technical consultation with internal teams and partners.

Skills

Familiarity with SPC

DOE principles

Cross-functional collaboration

Statistical analysis

Education

Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field

Master's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related field

Job description

Intel Corporation in Phoenix, AZ is seeking a Packaging Module Development Engineer to design and optimize assembly processes and equipment, improving quality, reliability, cost, yield and manufacturability across the packaging stack.

You will apply DOE and SPC methods, validate new techniques, and work with cross-functional teams to address packaging challenges and advance Intel's technology roadmap.