Packaging Module Engineer — Advanced Packaging Innovator

Intel Corporation; Phoenix (AZ); On-site; USD 134,000 - 189,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Chandler, Arizona, is seeking a college‑grad Packaging Module Development Engineer to advance semiconductor packaging technology. You will design, optimize, and qualify assembly processes and equipment to deliver high quality, reliable, and cost‑effective packaging for mobile and data center products.

You will lead DOE/SPC studies, develop novel techniques and materials, and work with suppliers to establish specifications while supporting development and high‑volume

Qualifications

• Bachelor's degree in engineering, physics, chemistry, or related STEM with 6+ months of industry experience.
• Master's degree in engineering, physics, chemistry, or related STEM with 6+ months of industry experience.
• PhD in Engineering, Physics, Chemistry, or related STEM field.
• Experience with SPC and DOE.
• Hands-on experience with process development, equipment qualification, and characterization in a packaging/manufacturing environment.
• Data analysis and risk assessment capabilities for technical decision-making.

Responsibilities

• Develop, optimize, and qualify packaging assembly processes and equipment to meet world-class quality, reliability, yield, and cost targets.
• Lead experimental design and process characterization using DOE and SPC methodologies.
• Innovate new techniques, materials, and tools to address emerging challenges in packaging quality and reliability.
• Collaborate with cross-functional teams to identify and mitigate technical risks, ensuring success across product development milestones.
• Establish and maintain specifications for materials and equipment, partnering with suppliers to meet performance and quality standards.
• Provide technical consultation and support for packaging challenges in both development and high-volume manufacturing environments.
• Document technical findings, process improvements, and experimental results in reports, white papers, and qualification documents.
• Drive standardization in manufacturing systems, equipment setups, and process flows across Intel sites globally.

Skills

DOE

SPC

Data analysis

Risk assessment

Education

Bachelor's degree in engineering/physics/chemistry

Master's degree in engineering/physics/chemistry

PhD in Engineering/Physics/Chemistry

Tools

Python

MATLAB

SQL

Job description

Intel Corporation in Chandler, Arizona, is seeking a college‑grad Packaging Module Development Engineer to advance semiconductor packaging technology. You will design, optimize, and qualify assembly processes and equipment to deliver high quality, reliable, and cost‑effective packaging for mobile and data center products.

You will lead DOE/SPC studies, develop novel techniques and materials, and work with suppliers to establish specifications while supporting development and high‑volume