Senior Die Packaging Module Engineer

Socket.dev; Rio Rancho (NM); On-site; USD 104,000 - 199,000; Full time

Job summary

Intel Corporation is seeking a Module Engineer to advance high-volume IC manufacturing. You will oversee critical equipment and processes, driving device miniaturization, quality, and yield to keep Intel at the forefront of semiconductor innovation.

You will lead DOE-driven optimization, perform tests, and implement modifications to boost productivity. Responsibilities include maintenance, upgrades, and facilitating global technology transfer through training, audits, and documentation.

Qualifications

• Experience in semiconductor metrology and process characterization.
• Strong knowledge of DOE principles and their application to optimization.
• Experience with process controls, excursions, and changes.
• Familiarity with statistical methods and tool qualification.

Responsibilities

• Operate and optimize high-volume manufacturing equipment and processes.
• Conduct tests and measurements to evaluate performance and implement improvements.
• Lead maintenance, repairs, and upgrades for equipment and modules.
• Drive continuous improvement to safety, productivity, and yield.
• Facilitate technology transfer to global sites via training and audits.
• Oversee equipment installation and qualification during factory ramps.

Skills

Metrology expertise

DOE principles

Process optimization

Data-driven decision making

Education

Bachelor's in STEM

Master's degree preferred

PhD considered

Job description

Intel Corporation is seeking a Module Engineer to advance high-volume IC manufacturing. You will oversee critical equipment and processes, driving device miniaturization, quality, and yield to keep Intel at the forefront of semiconductor innovation.

You will lead DOE-driven optimization, perform tests, and implement modifications to boost productivity. Responsibilities include maintenance, upgrades, and facilitating global technology transfer through training, audits, and documentation.