ATD MIHL Equipment Development Engineer
Intel
Get more replies from employers
Send a job-specific resume in minutes.
Benefits offered by this job
Job summary
Intel’s Packaging Module Development team seeks a Packaging Module Development Engineer to design and optimize processes and equipment for next‑gen packaging solutions. You will drive DOE studies, reliability benchmarking, and manufacturability improvements to boost efficiency and product quality.
You will collaborate with cross‑functional teams to align with roadmaps, lead technical investigations, and implement innovative quality screens to address packaging challenges across Intel’s
Qualifications
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
- -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
- -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
Responsibilities
- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
- Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
- Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
- Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
- Lead problem‑solving initiatives and drive continuous improvement in equipment and processes.
- Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
- Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.
Skills
Education
Tools
Job description
Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies. As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions. Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.
Job Description:
Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio. This group collaborates with cross‑functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world‑class technologies.
- Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
- Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports.
- Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks.
- Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges.
- Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs.
- Lead problem‑solving initiatives and drive continuous improvement in equipment and processes.
- Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
- Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. This position is not eligible for Intel immigration sponsorship.
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
- -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience.
- -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
- Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing
- Competency in mechanical design software such as SolidWorks or AutoCAD.
- Proven ability to lead technical innovation and manage complex, time‑sensitive projects.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Experience with high‑precision manufacturing methods, including stamping and CNC machining.
Join Intel's team of innovators and contribute to defining the future of technology.
Experienced Hire
Shift 1 (United States of America)
US, Arizona, Phoenix
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
N/A
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $115,110.00 - 188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job‑related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
This role will require an on‑site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
'/%3e%3cpath%20d='M101.744%2012.4726L102.894%2016.1947L99.0021%2013.2201L101.744%2012.4726ZM105.3%208.40937H100.488L99.0026%203.59473L97.5116%208.41047L92.7%208.40385L96.5965%2011.3834L95.1055%2016.1942L99.0021%2013.2196L101.408%2011.3834L105.3%208.40992V8.40937Z'%20fill='white'/%3e%3cdefs%3e%3clinearGradient%20id='paint0_linear_5593_1381'%20x1='90'%20y1='9.44471'%20x2='99'%20y2='9.44471'%20gradientUnits='userSpaceOnUse'%3e%3cstop%20stop-color='%2300AD70'/%3e%3cstop%20offset='0.998594'%20stop-color='%2300B67A'/%3e%3cstop%20offset='1'%20stop-color='%23DCDCE6'/%3e%3c/linearGradient%3e%3c/defs%3e%3c/svg%3e){kind=small}
