Packaging Engineer Intern: Build & Prototype Semiconductors

Fab2; Austin (TX); Vor Ort; USD 108.000 - 126.000; Vollzeit

Benefits dieser Stelle

Housing stipend

Meals provided

Weekly learning opportunities

Commuter benefits

Paid time off

Visa sponsorship

Health, dental, and vision insurance

401(k) retirement plan

Life and disability insurance

Zusammenfassung

fab2 in Austin, TX is seeking Semiconductor Packaging Engineering Interns for the winter term. The role is hands-on and hardware-focused, involving mechanical prototyping, experiment design, and data analysis. You will work on packaging fabrication equipment and join cross-functional engineering teams to improve processes.

The internship begins in January for 4–8 months. Interns receive training on tools including 3D printing, lithography, metallization, and metrology, with pay aligned to an

Qualifikationen

• Pursuing a Bachelor's Degree in engineering.
• 1–2 hands-on wet lab or lab-adjacent experiences preferred.
• Strong foundation in mechanical engineering and design.
• Hands-on prototyping experience and rapid design iteration.

Aufgaben

• Design and iterate machines and subsystems for semiconductor packaging fabrication (laser ablation, reflow ovens, automated plating).
• Integrate mechanical, electrical, and optical components in system assembly (wiring, optics alignment, electronics).
• Collaborate with cross-functional teams to improve fabrication processes and equipment.
• Hands-on package/wafer processing (3D printing, plating, lithography, metrology).

Kenntnisse

Prototype development

Mechanical design

Cross-functional collaboration

Hands-on engineering

Ausbildung

Bachelor's degree in engineering

Tools

SolidWorks

Onshape

Metrology equipment

Jobbeschreibung

fab2 in Austin, TX is seeking Semiconductor Packaging Engineering Interns for the winter term. The role is hands-on and hardware-focused, involving mechanical prototyping, experiment design, and data analysis. You will work on packaging fabrication equipment and join cross-functional engineering teams to improve processes.

The internship begins in January for 4–8 months. Interns receive training on tools including 3D printing, lithography, metallization, and metrology, with pay aligned to an