Packaging Engineering Intern

Texas Instruments

Dallas (TX)

On-site

USD 30,000 - 39,000

Full time

2 hours ago
Be an early applicant
Application generator

An application made for this job — a tailored resume and cover letter that speak straight to the posting.

Get past ATS filters

Job summary

Texas Instruments is seeking a Packaging Engineering Intern to help design, develop, and analyze semiconductor packaging technologies such as Wirebond, Flip Chip, Modules and SIPs. You will collaborate with cross‑functional teams to deliver solutions across material, mechanical, thermal, and electrical characterization, enabling high reliability and performance.

The role emphasizes teamwork, initiative, and timely project delivery within a fast‑paced environment, with TI supporting your career

Qualifications

  • Pursuing a Bachelor's degree in a relevant engineering field.
  • Cumulative 3.0/4.0 GPA or higher.

Skills

Semiconductor packaging knowledge
Analytical and problem solving
Written and verbal communication
Team collaboration
Time management
Relationship building
Initiative and drive for results

Education

Bachelor's degree in Mechanical Engineering / Materials Science / Chemical Engineering / Physics / Electrical Engineering

Job description

Change the world. Love your job.


Job Description

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross‑functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.


Put your talent to work with us as a Packaging Engineering Intern !


Texas Instruments will not sponsor job applicants for visas or work authorization for this position.


Qualifications

Minimum Requirements


  • Currently pursuing an Bachelors degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering or related.

  • Cumulative 3.0/4.0 GPA or higher


Preferred Qualifications


  • Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)

  • Demonstrated analytical and problem solving skills

  • Strong written and verbal communication skills

  • Ability to work in teams and collaborate effectively with people in different functions

  • Strong time management skills that enable on‑time project delivery

  • Ability to build strong, influential relationships

  • Ability to work effectively in a fast‑paced and rapidly changing environment

  • Ability to take the initiative and drive for results


About Us

Why TI?


  • Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.

  • We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours. Meet the people of TI

  • Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well‑being is important to us. Please find our country‑specific benefits here


About Texas Instruments

Texas Instruments Incorporated (Nasdaq: TXN) is a global semiconductor company that designs, manufactures and sells analog and embedded processing chips for markets such as industrial, automotive, data center, personal electronics and communications equipment. At our core, we have a passion to create a better world by making electronics more affordable through semiconductors. This passion is alive today as each generation of innovation builds upon the last to make our technology more reliable, more affordable and lower power, making it possible for semiconductors to go into electronics everywhere. Learn more at TI.com .


Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment. All qualified applicants will receive consideration for employment without regard to race, color, religion, creed, disability, genetic information, national origin, gender, gender identity and expression, age, sexual orientation, marital status, veteran status, or any other characteristic protected by federal, state, or local laws.


About The Team

TI does not make recruiting or hiring decisions based on citizenship, immigration status or national origin. However, if TI determines that information access or export control restrictions based upon applicable laws and regulations would prohibit you from working in this position without first obtaining an export license, TI expressly reserves the right not to seek such a license for you and either offer you a different position that does not require an export license or decline to move forward with your employment.

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Packaging Engineering Intern MSPhD
Packaging Engineering Intern MSPhD

Texas Instruments • Dallas (TX)

On-site
USD 30,000 - 39,000
Applications Engineering Intern
Applications Engineering Intern

Texas Instruments • Knoxville (TN)

On-site
USD 42,000 - 52,000
Product Engineering Intern
Product Engineering Intern

Texas Instruments • Knoxville (TN)

On-site
USD 28,000 - 41,000
Program Management Engineer Intern
Program Management Engineer Intern

Texas Instruments • Knoxville (TN)

On-site
USD 28,000 - 41,000
Digital IC Design Engineering Intern Bachelors
Digital IC Design Engineering Intern Bachelors

Texas Instruments • Knoxville (TN)

On-site
USD 28,000 - 41,000
Analog IC Design Engineering Intern Bachelors
Analog IC Design Engineering Intern Bachelors

Texas Instruments • Knoxville (TN)

On-site
USD 30,000 - 47,000
Sales Engineering Intern Novi MI
Sales Engineering Intern Novi MI

Texas Instruments • Novi (MI)

On-site
USD 28,000 - 39,000
Benefits package
Field Applications Engineering Intern
Field Applications Engineering Intern

Texas Instruments Incorporated • Town of Poland (NY)

On-site
Analog IC Design Engineering Intern MSPhD
Analog IC Design Engineering Intern MSPhD

Texas Instruments • Knoxville (TN)

On-site
USD 28,000 - 41,000
Applications Engineering Intern
Applications Engineering Intern

Texas Instruments • Sugar Land (TX)

On-site
USD 33,000 - 44,000