Packaging Engineer – Fast-Paced Global Team (CAP)

Texas Instruments Incorporated; Dallas, Northern (TX, KY); Hybrid; USD 70,000 - 90,000; Full time

Job summary

Texas Instruments Incorporated in Dallas is seeking a Packaging Engineer as part of the TMG Development program, a 12-month accelerated path for new graduates designed to accelerate ramp into TI and set you up for long-term career success.

You will design and analyze semiconductor packaging technologies, support product qualification, and collaborate across cross-functional teams to deliver high-reliability, low-power solutions in a fast-paced environment.

Qualifications

• Pursuing or recently completed a engineering degree; interest in packaging technologies.

Responsibilities

• Partner with businesses to design and develop packaging technologies for TI's analog and embedded processing products.
• Participate in cross-functional teams to support product qualification and production, meeting reliability and yield requirements.
• Conduct design-of-experiments and collaborate with material suppliers to evaluate packaging materials for reliability and performance.
• Model electrical, mechanical, and thermal interactions to inform design rules and prevent high-risk designs.

Skills

Cross-functional collaboration

Problem solving

Adaptability

Prioritization

Education

Bachelor's degree in Engineering

Job description

Texas Instruments Incorporated in Dallas is seeking a Packaging Engineer as part of the TMG Development program, a 12-month accelerated path for new graduates designed to accelerate ramp into TI and set you up for long-term career success.

You will design and analyze semiconductor packaging technologies, support product qualification, and collaborate across cross-functional teams to deliver high-reliability, low-power solutions in a fast-paced environment.