Packaging Engineer: Accelerate Your Semiconductor Career

Socket.dev; Dallas (TX); On-site; USD 65,000 - 85,000; Full time

Job summary

Texas Instruments is seeking a Packaging engineer as part of the TMG Development program for new graduates. You will design, analyze and optimize semiconductor packaging technologies to enable differentiation of TI's analog and embedded processing products.

The role involves collaboration across functions, conducting experiments, modeling, and ensuring reliability and performance while working in a fast‑paced environment. TI offers a 12‑month CAP program to accelerate your professional growth.

Qualifications

• Minimum Requirements: Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related
• Cumulative 3.0/4.0 GPA or higher

Responsibilities

• Partner with the businesses to design and develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness
• Participate in cross‑functional teams, supporting product qualification and production, helping to meet reliability and yield requirements, design testability, and test coverage
• Direct design‑of‑experiments and work with material suppliers to downselect innovative packaging materials to enhance the reliability and performance of advanced packages.
• Conduct electrical, mechanical, thermal models to comprehend silicon‑to‑package interaction, establish design rules, and to predict and prevent the use of high risk designs.

Education

Bachelor's degree in Material Science, Mechanical Engineering, Chemical Engineering, Physics, Electrical Engineering or related

Job description

Texas Instruments is seeking a Packaging engineer as part of the TMG Development program for new graduates. You will design, analyze and optimize semiconductor packaging technologies to enable differentiation of TI's analog and embedded processing products.

The role involves collaboration across functions, conducting experiments, modeling, and ensuring reliability and performance while working in a fast‑paced environment. TI offers a 12‑month CAP program to accelerate your professional growth.