Silicon Photonics Packaging Intern: 2.5D/3D Co-Packaged Optics

GLOBALFOUNDRIES U.S. INC.; Town of Malta (NY); On-site; USD 28,000 - 55,000; Part time

Job summary

GlobalFoundries is seeking a summer 2027 intern to support development of electro-optical transceivers using the Photonix platform and advanced co-packaged optics. The role covers thermal, mechanical, electrical, and optical chip-package co-design with emphasis on module performance and reliability.

This hands‑on internship includes mentorship, growth opportunities, and collaboration with design and manufacturing teams across GF's ecosystem.

Qualifications

• Education – Actively pursuing a Bachelor's or Master’s degree in a relevant field with a minimum 3.0 GPA.
• Current student status and ability to commit to the internship duration.
• Strong interest in semiconductor packaging, photonics, or co-packaged optics.
• Proven communication skills and teamwork experience.

Responsibilities

• Support packaging design rules, product requirements, and manufacturing processes with internal teams and OSAT partners.
• Participate in cross-functional design reviews and address manufacturability and reliability concerns.
• Develop analysis or simulation models to evaluate package performance, cost, and quality.
• Contribute to qualification robustness and continuous improvement from concept to production readiness.

Skills

English fluency

Education

Electrical Engineering

Mechanical Engineering

Materials Science

Photonics

Optical Engineering

Packaging Engineering

Job description

GlobalFoundries is seeking a summer 2027 intern to support development of electro-optical transceivers using the Photonix platform and advanced co-packaged optics. The role covers thermal, mechanical, electrical, and optical chip-package co-design with emphasis on module performance and reliability.

This hands‑on internship includes mentorship, growth opportunities, and collaboration with design and manufacturing teams across GF's ecosystem.