Packaging & Silicon Photonics Engineer - New Grad

GlobalFoundries; United States; On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries in the United States is seeking a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers to support chip package co-design for electro‑optical transceivers using GF’s Photonix platform and 2.5D/3D packaging.

The role covers thermal, mechanical, electrical, and optical design integration, including design rule development, simulation, manufacturability assessments,

Qualifications

• Education – Graduating with a Bachelor’s, Master’s, or PhD degree in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering, or a related STEM discipline from an accredited degree program.
• Must have at least an overall 3.0 GPA and proven good academic standing.
• Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or manufacturing processes gained through coursework, research, internships, co-ops, or academic projects.
• Demonstrated analytical and problem-solving skills.
• Experience analyzing experimental, simulation, or engineering data.
• Ability to work effectively within cross-functional teams.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 10%.

Responsibilities

• Support packaging design integration activities for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.
• Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.
• Use engineering data, simulations, and characterization results to help evaluate design options and identify improvement opportunities.
• Participate in cross-functional problem-solving efforts related to technical, yield, quality, and reliability concerns.
• Support development and documentation of design guidelines, technical reports, and presentation materials.
• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.
• Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.

Skills

Analytical thinking

Problem solving

Cross-functional teamwork

Communication skills

Planning & organization

Leadership (project)

Education

Bachelor/Master/PhD in STEM

Tools

HFSS

Zemax

FloTHERM

FEA software

Job description

GlobalFoundries in the United States is seeking a New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. You will collaborate with experienced engineers to support chip package co-design for electro‑optical transceivers using GF’s Photonix platform and 2.5D/3D packaging.

The role covers thermal, mechanical, electrical, and optical design integration, including design rule development, simulation, manufacturability assessments,