Optical Interconnect Systems Lead: 400G/800G Validation

Advanced Micro Devices; Santa Clara (CA); On-site; USD 170,000 - 210,000; Full time

Job summary

AMD in Santa Clara, California is seeking an Optical Interconnect System Integration and Qualification Engineer to lead system‑level integration and qualification for next‑generation optical and high‑speed electrical interconnects for AI scale‑out platforms.

This role requires hands‑on optical transceiver qualification and collaboration across optics, SerDes, SI/PI, firmware, ASICs, boards, and platform teams to drive qualification readiness and influence future interconnect solutions.

Qualifications

• Experience in optical networking and high‑speed interconnects.
• 8+ years in hardware validation or system interconnect qualification.
• Proficiency with optical transceivers and SerDes validation across 100G/200G per‑lane PAM4.

Responsibilities

• Lead optical transceiver and cable qualification at module and system levels.
• Develop qualification plans for 400G, 800G, and 1.6T transceivers and related interconnects.
• Perform system-level validation including SI/PI, BER testing, and eye analysis.
• Collaborate with ASIC, firmware, diagnostics, software, and platform teams.
• Create Python-based automation for test execution and data analysis.

Skills

Optical networking

High-speed interconnects

System qualification

SerDes validation

Python automation

Cross-functional leadership

Debugging/analysis

Education

B.S./M.S. in Electrical Engineering

Ph.D. or equivalent

Tools

DCA‑X

BERT

OSA

VNA

Job description

AMD in Santa Clara, California is seeking an Optical Interconnect System Integration and Qualification Engineer to lead system‑level integration and qualification for next‑generation optical and high‑speed electrical interconnects for AI scale‑out platforms.

This role requires hands‑on optical transceiver qualification and collaboration across optics, SerDes, SI/PI, firmware, ASICs, boards, and platform teams to drive qualification readiness and influence future interconnect solutions.