Senior Leader, Next-Gen Electrical & Optical Interconnects

Qualcomm; San Diego (CA); On-site; USD 250,000 - 375,000; Full time

Benefits offered by this job

Annual bonus program

RSU grants

Competitive benefits package

Job summary

Qualcomm Technologies, Inc. seeks a Senior Leader, Electrical & Optical Systems Engineer to define and productize next-generation interconnect technologies for AI, hyperscale datacenter, networking and HPC systems.

You will lead architecture for 112G/224G SerDes, EIC/PIC integration, optical engines, and advanced packaging while guiding DSP, COM analysis and system-level modeling across multiple engineering disciplines.

Qualifications

• 15+ years in high-speed comms, networking or optical interconnects.
• Productization of 112G/224G PAM4 systems experience.
• Experience with 224G+ electrical/optical interconnects.

Responsibilities

• Define end-to-end interconnect architectures including 112G, 224G and emerging 448G SerDes.
• Lead design across SerDes, PHY, optical engines, substrates, PCB channels, connectors and CPC/NPC architectures.
• Own SI/PI methodology, channel budgeting, jitter and equalization strategy.
• Drive DSP architecture for TX/RX, CDR, adaptive filtering, FEC and impairment compensation.
• Develop system models and tradeoff studies for bandwidth, power, latency and cost.
• Provide technical leadership across silicon, packaging, optics, platform, and software.

Skills

High-speed SerDes

PAM4

SI/PI

EIC/PIC co-design

Optical engines

Co-packaged/near-packaged optics

System-level modeling

Python

MATLAB

Verilog/SystemVerilog

CPD/NPC architectures

Education

Bachelor's degree in Electrical Engineering or related field

Master's degree preferred

PhD beneficial

Tools

ADS

HFSS

CST

HSPICE

MATLAB

Python

Cadence Sigrity

Lumerical

Zemax

Verilog-A

SystemVerilog

COM analysis tools

IBIS-AMI modeling

Job description

Qualcomm Technologies, Inc. seeks a Senior Leader, Electrical & Optical Systems Engineer to define and productize next-generation interconnect technologies for AI, hyperscale datacenter, networking and HPC systems.

You will lead architecture for 112G/224G SerDes, EIC/PIC integration, optical engines, and advanced packaging while guiding DSP, COM analysis and system-level modeling across multiple engineering disciplines.