Senior Leader, Electrical & Optical Interconnect Systems

Transmission & Distribution World; San Diego, Northern (CA, KY); Hybrid; USD 250,000 - 375,000; Full time

Job summary

Qualcomm Technologies, Inc. is seeking a Senior Leader, Electrical & Optical Systems Engineer to define, develop, and productize next-generation interconnect technologies for AI and hyperscale datacenters.

The role covers silicon, photonics, packaging, PCB, and rack-scale infrastructure with leadership across multiple engineering disciplines. The candidate will drive end-to-end architecture for high-speed interconnects, lead DSP algorithm development, and own SI/PI methodologies, collaborating

Qualifications

• MS or PhD in Electrical Engineering or related field.
• 15+ years of experience in high-speed interconnects or related领域.
• Experience productizing 224G+ electrical/optical interconnect solutions.
• Familiarity with CPO, NPO, CPC, NPC, flyover architectures and silicon photonics.

Responsibilities

• Define end-to-end architecture for next-gen interconnect solutions (112G/224G/448G).
• Lead system design across SerDes, PHY, optics, packaging, and PCBs.
• Own SI/PI methodology and link analysis including jitter and crosstalk.
• Drive DSP architecture and algorithms for TX/RX equalization and FEC.
• Develop system-level models and trade studies for performance, power, and cost.
• Provide technical leadership across silicon, package, optics, and software teams.

Skills

224G SerDes

Electrical-optical DSP

PAM4

SI/PI

EIC/PIC integration

Optical networking

Advanced packaging

System architecture

Education

MS in Electrical Engineering

PhD in Electrical Engineering

Tools

ADS

HFSS

CST

HSPICE

MATLAB

Python

Cadence Sigrity

Lumerical

Zemax

Verilog-A

SystemVerilog

COM analysis tools

IBIS-AMI modeling

Job description

Qualcomm Technologies, Inc. is seeking a Senior Leader, Electrical & Optical Systems Engineer to define, develop, and productize next-generation interconnect technologies for AI and hyperscale datacenters.

The role covers silicon, photonics, packaging, PCB, and rack-scale infrastructure with leadership across multiple engineering disciplines. The candidate will drive end-to-end architecture for high-speed interconnects, lead DSP algorithm development, and own SI/PI methodologies, collaborating