Memory Packaging Engineer

MediaTek Research Lab Inc.; San Jose (CA); On-site; USD 180,000 - 301,000; Full time

Benefits offered by this job

Comprehensive health insurance

Life and disability insurance

401(k) plan

Paid holidays

Job summary

MediaTek Research Lab Inc. in San Jose is seeking a visionary memory packaging technical leader for their Advanced Packaging Development team. You will lead the development of innovative 2.5D/3D packaging solutions that are vital for multiple business units.

The ideal candidate will possess a deep technical background, lead memory roadmap initiatives, manage supplier relationships, and ensure product quality and reliability. This leadership role offers a salary range of $180,000 to $301,000, along with comprehensive benefits.

Qualifications

• Comprehensive knowledge of package co-design, electrical Signal/Power Integrity (SI/PI), thermal management.
• Hands-on understanding of diverse memory package architectures and their manufacturing process flows.
• Expertise in package-level and memory-level failure analysis and root-cause problem-solving.

Responsibilities

• Lead the memory roadmap development and package integration plan.
• Establish and manage third-party relationships with memory vendors.
• Monitor and report project progress to senior management.

Skills

Advanced Packaging Fundamentals

Memory Architecture & Process Expertise

JEDEC Standard Mastery

Technology Readiness & Integration

Advanced Failure Analysis

Supply Chain & Partner Management

Technical Leadership

Job description

Mediatek is seeking a visionary and memory packaging technical leader to join our US team for Advanced Packaging Development. In this strategic role, you will lead and drive the development of cutting‑edge 2.5D/3D packaging and memory subsystem solutions critical to our Datacenter/HPC, AI, Automotive, and Computing business units. You will serve as the key technical coordinator to bridge internal cross‑functional teams, external customers, and external manufacturing partners. Your team’s mission is to lead the memory roadmap that meets the agenda of the advanced packaging technologies and deliver the product from concept through to mass production. We are looking for an owner who combines deep technical expertise with strategic thinking, supply‑chain management experience, and a solid commitment to customer obsession.

Roles and Responsibilities

• Supports MediaTek’s Memory packaging technology development including but not limited to HBM package, cHBM, LPDDR package for mobile applications, In‑Package Memory (IPM) for Edge AI, etc.
• Technical Leadership and Development: Lead the memory roadmap development and package integration plan. Collaborate closely with IP, ASIC design, package design, Signal Integrity (SI), Power Integrity (PI), Thermal and modeling technologies, Product Engineering, and Test Engineering teams to enable innovative solutions.
• Supply Chain and Technical Partner Management: Establish and manage third‑party relationships with memory vendors. Drive material selection and BOM optimization to ensure manufacturability to meet electrical, mechanical, thermal, and system‑level requirements.
• Communication and Stakeholder Management: Monitor and report project progress, supply‑chain performance, and manufacturing metrics to senior management. Serve as the primary interface for external customers and key enablement partners to ensure alignment on product quality, reliability, system needs, and optional requirements.
• Travel: Domestic and international travel required (10–15%) to closely collaborate with partners/suppliers, customer engagements, and internal team alignment.

Main Requirements and Qualifications

• Advanced Packaging Fundamentals: Comprehensive knowledge of package co‑design, electrical Signal/Power Integrity (SI/PI), thermal management, and thermomechanical principles. Expert understanding of inherent 2.5D/3D integration challenges, including warpage, CTE mismatch, die stress, and micro‑interconnect reliability.
• Memory Architecture & Process Expertise: Deep, hands‑on understanding of diverse memory package architectures and their end‑to‑end manufacturing process flows.
• JEDEC Standard Mastery: Comprehensive knowledge of JEDEC specifications across a wide spectrum of memory technologies, including HBM, LPDDR, and GDDR.
• Technology Readiness & Integration: Proven track record of evaluating memory technology readiness and driving seamless integration from concept to mass production (e.g., cHBM for HPC/AI applications, In‑package memory or stacked memory for power/area constrained applications).
• Advanced Failure Analysis: Expertise in package‑level and memory‑level failure analysis (FA), defect isolation, and driving root‑cause problem solving to improve yield and reliability.
• Supply Chain & Partner Management: Proven ability to manage complex BOMs, procurement strategies, logistics, and inventory. Exceptional track record of building and maintaining strategic relationships with key enablement partners, memory vendors, and customers.
• Technical Leadership: Demonstrated ownership, high standards, strategic thinking, and customer obsession. Proven ability to establish new technical capabilities, mentor junior engineers, and influence cross‑functional teams.
• Salary range: $180,000–$301,000
• Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent on the individual’s skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, company‑paid holidays, sick leave, vacation time, parental leave, 401(k) and more.
• MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.