2027 Campus_Package Architect

MediaTek

San Jose (CA)

On-site

USD 122,000 - 213,000

Full time

26 hours ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Health insurance
Life insurance
Disability insurance
Savings plan (401K)
Paid holidays
Sick leave
Vacation time
Parental leave

Job summary

MediaTek, the world‑class fabless IC design leader, is seeking a graduate student to join the Data Center Product Architecture and Technology team. You will help develop and evaluate packaging solutions for next‑gen AI silicon, and perform signal and power integrity analyses for high‑speed interfaces.

Location: San Jose, California (on‑site) or Portland, Oregon (on‑site). You will work with cross‑functional teams to improve packaging solutions, analyze SI/PI, and contribute to future data center

Qualifications

  • MS in Electrical Engineering or related field expected by 2027.
  • Solid understanding of VLSI package design and silicon interactions.
  • Experience with transient and frequency domain analysis.
  • Good understanding of silicon packaging and deep submicron silicon process.
  • Proficient with package layout tools (Cadence Allegro) and SI/PI tools (HFSS).

Responsibilities

  • Develop and evaluate packaging solutions for next generation data center and AI silicon products.
  • Signal and Power integrity analysis for high speed interfaces; Power delivery network design.
  • Collaborate with cross functional teams to improve packaging solution in key vectors including performance and form factor.
  • Understand Industry and technology trends.

Skills

VLSI packaging
Silicon interactions
Transient analysis
Frequency domain analysis
Silicon packaging experience

Education

MS in Electrical Engineering

Tools

Cadence Allegro
Ansys HFSS

Job description

MediaTek is the world’s fifth largest fabless IC design company, offering a diverse range of products for AI, smartphones, smartwatches, tablets, WiFi, TV, Automotive, data center processing and interconnect, voice assistant devices, drones, navigation systems and so on, most of which have the biggest market share in the world. At MediaTek, we foster a diverse and supportive culture that empowers employees to achieve their ultimate potential. We are ranked second in Newsweek's 2024 list of the World's Most Trustworthy Companies for Technology Hardware and one of Forbes’ World’s Best Employers 2024.Are you a recent graduate with a passion for cutting‑edge technology? Do you dream of working on groundbreaking projects that shape the future of data centers, AI, and high‑performance computing? If so, we have an exciting opportunity for you! Our Data Center Product Architecture and Technology team is at the forefront of innovation, developing state‑of‑the‑art architecture and technology solutions for data centers that power cloud infrastructure and the rapidly growing AI industry. We are a fast‑growing, dynamic team dedicated to pushing the boundaries of technology.Location: San Jose, California (on‑site) or Portland, Oregon (on‑site)

  • Develop and evaluate packaging solutions for next generation data center and AI silicon products.
  • Signal and Power integrity analysis for high speed interfaces. Power deliver network design and analysis for next generation XPUs.
  • Collaborate with cross functional teams to improve packaging solution in key vectors including performance and form factor.
  • Understand Industry and technology trends.

#LI-WC2

Main Requirements and Qualifications
  • Requirement
  • Student graduated after December 2026 or in 2027 with a M.S. or higher degree in Electrical Engineering or a related field in Physics.
  • Solid understanding of VLSI package design and silicon interactions.
  • Experience with transient and frequency domain analysis.
  • Good understanding of silicon packaging and deep submicron silicon process
  • Proficient with package layout tool (e.g. Cadence Allegro) and SI/PI tools (e.g Ansys HFSS).
  • Able to assume responsibility for a variety of technical tasks and to work independently
  • Excellent working attitude and good interpersonal and communication skills.
  • Salary range: $122,000- $213,000
  • Employee may be eligible for performance bonus, short and long term incentive programs. Actual total compensation will be dependent upon the individual's skills, experience and qualifications. In addition, MediaTek provides a variety of benefits including comprehensive health insurance coverage, life and disability insurance, savings plan, Company paid holidays, Sick Leave, Vacation time, Parental leave, 401K and more.
  • MediaTek is an Equal Opportunity Employer that is committed to inclusion and diversity to all, regardless of age, ancestry, color, disability (mental and physical), exercising the right to family care and medical leave, gender, gender expression, gender identity, genetic information, marital status, medical condition, military or veteran status, national origin, political affiliation, race, religious creed, sex (includes pregnancy, childbirth, breastfeeding and related medical conditions), and sexual orientation.
Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Packaging Architect
Packaging Architect

MediaTek • San Jose (CA)

On-site
USD 171,000 - 272,000
Comprehensive health insurance
401(k) plan
Paid holidays and leave
2027 Campus_Analog and Mixed Signal Design
2027 Campus_Analog and Mixed Signal Design

MediaTek • San Jose (CA)

On-site
USD 122,000 - 213,000
Packaging Manager/Director
Packaging Manager/Director

MediaTek • San Jose (CA)

On-site
USD 200,550 - 322,250
Comprehensive health insurance
401(k)
Parental leave
Package Development/NPI Engineer
Package Development/NPI Engineer

MediaTek • San Jose (CA)

Hybrid
USD 180,000 - 301,000
Comprehensive health insurance
401(k)
Paid holidays and vacation time
Optical 3D Packaging Technologist
Optical 3D Packaging Technologist

MediaTek • San Jose (CA)

On-site
USD 188,000 - 356,000
Health insurance
401K plan
Parental leave
Memory Packaging Engineer
Memory Packaging Engineer

MediaTek • San Jose (CA)

On-site
USD 180,000 - 301,000
Comprehensive health insurance
Life and disability insurance
401(k) plan
+1
Technology Marketing Manager - Datacenter
Technology Marketing Manager - Datacenter

MediaTek Research Lab Inc. • San Jose (CA)

On-site
USD 151,000 - 168,000
Comprehensive health insurance
401(k) plan
Paid holidays and sick leave
+1
Market Intelligence Analyst
Market Intelligence Analyst

MediaTek • San Jose (CA)

On-site
USD 171,000 - 286,000
Health insurance
Life insurance
Disability insurance
+6
System Expert for Post-silicon including SLT
System Expert for Post-silicon including SLT

MediaTek • San Jose (CA)

Hybrid
USD 150,000 - 266,000
Health insurance
Life insurance
Disability insurance
+6
Technical Program Manager
Technical Program Manager

MediaTek • San Jose (CA)

On-site
USD 140,000 - 250,000
Comprehensive health insurance
401(k) plan
Paid time off (PTO)