Next-Gen Memory Packaging Architect for AI & Datacenter

Micron Technology, Inc; San Jose (CA); On-site; USD 143,000 - 398,000; Full time

Job summary

Micron Technology, Inc. is seeking a senior packaging pathfinding expert to steer next‑generation memory packaging architectures for datacenter to edge‑AI. You will coordinate across silicon, packaging, board, and system teams to deliver scalable, high‑performance solutions.

The role requires deep memory packaging expertise, proficiency with leading EDA tools, and a track record of technical leadership across products. A Master’s degree and 6+ years of hands‑on experience are expected.

Qualifications

• Master’s degree or equivalent practical experience in EE, CE, CS, or related field.
• 6+ years of extensive hands‑on experience in memory systems package design, signaling, IO design, PDN design.
• Deep understanding of memory timing, signaling, power, package process technology.
• Working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including Cadence, Siemens and Ansys.
• Experience applying AI or LLMs for engineering efficiency.
• Recognized technical leadership across multiple products.

Responsibilities

• Define next‑generation package pathfinding and system architectures optimizing for speed performance, system bandwidth, power, capacity, thermal, mechanical and electrical performance.
• Lead cross‑stack co‑optimization across silicon, package, board, and system with package centric solutions approach.
• Drive long‑term memory technology packaging strategy and influence industry standards.
• Work closely with silicon, and system design teams and customers for next generation and long term disruptive solutions to boost speed performance for edge‑AI and datacenter memory products.
• Serve as a technical interface to internal partners, customers, BUs, senior leaders.
• Develop AI based multi‑physics solutions for efficiency gains.

Skills

Memory systems

Package design

Signal integrity

Power integrity

EDA tools

Education

Master's degree or equivalent in EE/CE/CS or related field

PhD in a related field

Tools

Cadence

Siemens

Ansys

Job description

Micron Technology, Inc. is seeking a senior packaging pathfinding expert to steer next‑generation memory packaging architectures for datacenter to edge‑AI. You will coordinate across silicon, packaging, board, and system teams to deliver scalable, high‑performance solutions.

The role requires deep memory packaging expertise, proficiency with leading EDA tools, and a track record of technical leadership across products. A Master’s degree and 6+ years of hands‑on experience are expected.