Global Director, DRAM Packaging & 3D Integration

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 250,000 - 350,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Benefits guide

Job summary

Micron Technology, Inc. seeks a Director of DRAM Packaging to lead strategy, development, and execution of advanced packaging across the memory portfolio.

You will define technology roadmaps, drive innovative packaging architectures, and build a high‑performing global engineering organization. You will collaborate with design, product engineering, manufacturing, quality, supply chain, and external partners to advance AI, analytics, and digital approaches that accelerate product delivery and

Qualifications

• Bachelor’s degree in Engineering, Materials Science, Physics, Computer Engineering, or related field.
• 15+ years of semiconductor packaging experience, from development to high‑volume manufacturing.
• 10+ years of leadership in engineering teams or global engineering organizations.

Responsibilities

• Define and execute long‑term DRAM packaging strategies aligned with product and business objectives.
• Lead development and deployment of advanced packaging technologies (HBM, LPDRAM, DDR, 2.5D/3D, heterogeneous integration, chiplets).
• Drive AI, analytics, and digital engineering to enhance product development, manufacturing, and productivity.
• Build and lead a global packaging organization focused on innovation and execution.
• Partner with cross‑functional teams to deliver products from concept to high‑volume manufacturing.
• Establish and maintain strategic relationships with customers, OSATs, foundries, suppliers, and research institutions.
• Guide technology investments via benchmarking, cost analysis, risk assessment, and case development.
• Foster scalable engineering processes, knowledge management, and data‑driven decisions.

Skills

Executive leadership

Semiconductor packaging

HBM

2.5D/3D integration

Heterogeneous integration

Agentic AI workflows

Education

Bachelor’s degree

Master’s degree

PhD

Job description

Micron Technology, Inc. seeks a Director of DRAM Packaging to lead strategy, development, and execution of advanced packaging across the memory portfolio.

You will define technology roadmaps, drive innovative packaging architectures, and build a high‑performing global engineering organization. You will collaborate with design, product engineering, manufacturing, quality, supply chain, and external partners to advance AI, analytics, and digital approaches that accelerate product delivery and