Senior Memory Systems Architect – AI, Cloud, HPC

Micron Technology

San Jose (CA)

On-site

USD 164,000 - 358,000

Full time

14 days+
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Job summary

Micron Technology is seeking a Technical Staff Member to lead systems-level architecture for next-generation memory solutions. You will work across engineering disciplines to evaluate tradeoffs, guide decisions, and develop differentiated memory technologies.

Responsibilities include defining architectures for DDR, LPDDR, HBM, and CXL-attached memory, plus building analytical models to assess performance, reliability, power, and cost.

Qualifications

  • 8+ years of experience in memory systems, semiconductor architecture, or related fields.
  • Strong knowledge of DRAM architecture and high-performance memory systems.
  • Experience using AI-powered tools, including LLMs and Generative AI, for simulations.

Responsibilities

  • Define architectures for DDR, LPDDR, HBM, and emerging memory technologies.
  • Develop analytical and simulation-based models to evaluate performance, reliability, power, thermal, and cost tradeoffs.
  • Drive architecture requirements across DRAM, packaging, modules, controllers, platforms, and system software.
  • Lead technical studies, roadmap development, and architecture recommendations supported by quantitative analysis.
  • Influence cross-functional teams, mentor engineers, and contribute to patents, publications, and standards activities.

Skills

Memory systems experience
Computer architecture
Quantitative analysis
AI-enabled simulations

Education

Master's degree or equivalent

Tools

Ramulator
Ramulator2
DRAMsim3
gem5

Job description

Micron Technology is seeking a Technical Staff Member to lead systems-level architecture for next-generation memory solutions. You will work across engineering disciplines to evaluate tradeoffs, guide decisions, and develop differentiated memory technologies.

Responsibilities include defining architectures for DDR, LPDDR, HBM, and CXL-attached memory, plus building analytical models to assess performance, reliability, power, and cost.

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