Next-Gen, High-Speed HBM, LPDDR Memory Controller ASIC Digital Design Engineer

Qualcomm; San Diego (CA); On-site; USD 140,000 - 230,000; Full time

Benefits offered by this job

Annual bonus program

RSU grants

Benefits package

Job summary

Qualcomm Technologies, Inc. in San Diego is seeking a Senior ASIC Design Engineer to contribute to next generation memory controller designs (HBM/LPDDR/DDR) at frequencies above 1 GHz.

You will work on RTL coding, architecture, and verification, collaborating with CPU, GPU, DSP teams, and drive synthesis, timing, and power analysis while delivering high quality ASICs. Requirements include 4+ years (Bachelor) or more with MS/PhD options; strong background in ASIC design and front-end digital

Qualifications

• Bachelor's or Masters degree in Science, Engineering, or related field.
• 5+ years ASIC design, RTL coding, front-end digital design experience
• 3+ years Hardware Architecture experience
• PhD in Science, Engineering, or related field and 2+ years experience (if applicable)

Responsibilities

• Architect, design (RTL coding), and deploy next-gen high-speed memory systems in Qualcomm products.
• Develop or contribute to architecture and design specifications and drive micro-architecture of design portions.
• Implement and deliver RTL and collaborate with verification engineers to deliver high-quality designs.
• Debug designs and provide debug support during integration.
• Perform Synthesis, Timing Closure, Physical Design Support, Gate Level Simulations, Power Analysis; drive design methodology improvements.

Skills

ASIC design

RTL coding

front-end digital design

Power analysis

Synthesis and timing closure

Education

Master's degree in Computer/Electrical Engineering

Bachelor's degree in Science/Engineering

PhD in Science/Engineering

Tools

RTL Design Verification flows

x86/ARM CPU architectures

Job description

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > ASICS Engineering

General Summary

Next Generation, High-Speed, Memory and Cache Controller Design Team is looking for a Senior ASIC Design Engineers for the next generation high speed HBM/LPDDR/DDR memory controller. The front end of the DDR controller interfaces to the rest of the system such as CPU, GPU, DSP, Multimedia Processors and the engineer is expected to be responsible for enabling high speed (1Ghz+) designs in QCT products.

Minimum Qualifications

• Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
• Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
• PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.

The candidate will work on architecture, design (RTL coding), and deployment of the next generation, high-speed memory systems into QCT products. You will develop or contribute to the development of architecture and design specifications and drive the micro-architecture of portions of the logic design. You will implement and deliver RTL and work with verification engineers to deliver high quality designs. You will be responsible for debugging your designs and also provide debug support when integrated into the rest of the chip. Synthesis, Timing Closure, Physical Design Support, Gate Level Simulations, Power Analysis are expected to be key tasks. You will make regular contributions to the overall improvement in design methodology to drive productivity and quality of results.

Qualifications

• Bachelor's or Masters degree in Science, Engineering, or related field.
• 5+ years ASIC design, RTL coding, front-end digital design experience
• 3+ years Hardware Architecture experience

Preferred Qualifications

• 3-10 years of ASIC design (RTL coding) Preferred
• Exposure to RTL Design Verification flows is a plus
• 3+ years of direct Hardware Architecture experience
• Bachelors degree in Electrical or Computer Engineering and at least 5+ years of experience in high speed digital design Master's degree preferred
• Experience with the following:
• LPDDR memory and cache controller, NoC based architectures especially the front end interfacing to the CPU, DSP, and multimedia processors
• Exposure to HBM memory type designs
• On-chip tightly coupled SRAM & L3 cache controller architecture/design
• Experience with x86 or ARM CPU/bus architectures
• Ordering of memory transactions and methods to enforce proper ordering in order to conform to ISA architecture specification

Education Requirements

Required: Master's, Computer Engineering and/or Electrical Engineering

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Pay range and Other Compensation & Benefits

$140,000.00 - $229,800.00

• The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm.
• We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus).
• In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play.
• Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link.

If you would like more information about this role, please contact Qualcomm Careers.