New Grad Packaging Integration Engineer

Global Foundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross‑functional engineering teams to support development and manufacturing of electro‑optical transceivers using GF's Photonix platform and 2.5D/3D packaging technologies.

The role involves package integration, process development, reliability characterization, and data analysis while gaining hands‑on

Qualifications

• GPA 3.0 or higher from an accredited program.
• Coursework/research related to semiconductor packaging, silicon photonics, or related tech.
• Demonstrated analytical and problem-solving skills.

Responsibilities

• Support assembly process integration for silicon photonics and advanced packaging products.
• Assist with process development, characterization, and qualification activities for new package technologies.
• Analyze engineering and manufacturing data to identify process improvements.

Skills

Analytical skills

Problem-solving

Cross-functional teamwork

English fluency

Data analysis

Education

Bachelors/Masters/PhD in STEM

Tools

DOE methodologies

Statistical data analysis tools

Job description

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Integration Engineer. You will collaborate with cross‑functional engineering teams to support development and manufacturing of electro‑optical transceivers using GF's Photonix platform and 2.5D/3D packaging technologies.

The role involves package integration, process development, reliability characterization, and data analysis while gaining hands‑on