New Grad: Packaging Design Integration Engineer

Global Foundries; Essex Junction (VT); On-site; USD 85,000 - 146,000; Full time

Job summary

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging technologies.

The engineer will contribute to thermal, mechanical, electrical, and optical design

Qualifications

• Bachelor's/Master's/PhD in a relevant STEM field from an accredited program.
• Overall GPA 3.0 or higher.
• Basic understanding of semiconductor packaging, silicon photonics, chip package co-design, modeling/simulation, materials science, reliability, or related processes.
• Demonstrated analytical and problem-solving skills.
• Experience analyzing experimental, simulation, or engineering data.
• Ability to work effectively within cross-functional teams.
• English language fluency (written & verbal).
• Travel up to 10%.

Responsibilities

• Support packaging design integration activities for silicon photonics and advanced packaging products.
• Assist with thermal, mechanical, electrical, and optical chip package co-design analysis under the guidance of experienced engineers.
• Contribute to design rule development, manufacturability assessments, and design review preparation for new package technologies.
• Use engineering data, simulations, and characterization results to help evaluate design options and identify improvement opportunities.
• Participate in cross-functional problem-solving efforts related to technical, yield, quality, and reliability concerns.
• Support development and documentation of design guidelines, technical reports, and presentation materials.
• Collaborate with design, product, process integration, manufacturing, quality, and supplier teams to support new customer products.
• Participate in continuous improvement initiatives focused on design quality, manufacturability, cost, and reliability.

Skills

Analytical skills

Problem-solving

Cross-functional teamwork

Data analysis

English fluency

Communication skills

Travel willingness

Education

Bachelor's/Master's/PhD in Mechanical Engineering, Electrical Engineering, Materials Science Engineering, Chemical Engineering, Physics, Optical Engineering or related STEM

GPA 3.0+

Tools

HFSS

Zemax

FloTHERM

Finite Element Analysis

Electrical simulation

Optical simulation

Job description

GlobalFoundries is seeking a highly motivated New College Graduate to join the Advanced Packaging and Silicon Photonics team as a Packaging Design Integration Engineer. In this role, you will collaborate with experienced engineers and cross-functional teams to support chip package co-design activities for electro-optical transceivers using GF's Photonix platform and advanced 2.5D/3D packaging technologies.

The engineer will contribute to thermal, mechanical, electrical, and optical design