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Intel Corporation in Phoenix, AZ seeks a Module Engineer to design and optimize assembly processes for advanced foundry packaging. You will apply DOE and SPC methods to improve yield, reliability, cost, and manufacturability across packaging platforms.
The role collaborates with engineering, manufacturing, and supplier teams to scale production, set specifications, and drive continuous improvement in packaging programs.
Intel Corporation in Phoenix, AZ seeks a Module Engineer to design and optimize assembly processes for advanced foundry packaging. You will apply DOE and SPC methods to improve yield, reliability, cost, and manufacturability across packaging platforms.
The role collaborates with engineering, manufacturing, and supplier teams to scale production, set specifications, and drive continuous improvement in packaging programs.