Module Engineer – Foundry Packaging (Day Shift, 5/7)

Intel Corporation

Phoenix (AZ)

Hybrid

USD 85,000 - 163,000

Full time

3 days ago
Be an early applicant
Application generator

Stand out for this role — generate a tailored resume and cover letter in about a minute.

Get past ATS filters

Benefits offered by this job

Stock bonuses
Health insurance
Retirement plan
Vacation

Job summary

Intel Corporation in Phoenix, AZ seeks a Module Engineer to design and optimize assembly processes for advanced foundry packaging. You will apply DOE and SPC methods to improve yield, reliability, cost, and manufacturability across packaging platforms.

The role collaborates with engineering, manufacturing, and supplier teams to scale production, set specifications, and drive continuous improvement in packaging programs.

Qualifications

  • US Citizenship required.
  • Experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE).
  • Background in mechanical/materials/chemical/electrical engineering relevant to packaging.

Responsibilities

  • Design and develop assembly processes and equipment for foundry packaging roadmap.
  • Optimize manufacturing efficiency meeting quality, cost, yield, and manufacturability targets.
  • Define process specs using DOE and data analysis; document improvements.
  • Develop equipment to evaluate silicon and package technologies under simulated field conditions.
  • Ensure manufacturability within foundry process flows and manage production cycles.
  • Establish material specs with suppliers and enforce vendor performance standards.
  • Create reliability screening techniques and quality tools to detect risks.
  • Lead continuous improvement using statistical methods and experimental design.
  • Provide technical consultation on process improvements and risk mitigation.

Skills

SPC
DOE

Education

Bachelor's degree in Mechanical Engineering
Master's degree in Mechanical Engineering

Job description

Intel Corporation in Phoenix, AZ seeks a Module Engineer to design and optimize assembly processes for advanced foundry packaging. You will apply DOE and SPC methods to improve yield, reliability, cost, and manufacturability across packaging platforms.

The role collaborates with engineering, manufacturing, and supplier teams to scale production, set specifications, and drive continuous improvement in packaging programs.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Module Engineer - Foundry Packaging & Process Improvement
Module Engineer - Foundry Packaging & Process Improvement

Intel Corporation • Chandler (AZ)

On-site
USD 85,000 - 163,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineering - Day Shift 5 or 7
Module Engineering - Day Shift 5 or 7

Intel Corporation • Chandler (AZ)

On-site
USD 85,000 - 163,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineering - Day Shift 5 or 7
Module Engineering - Day Shift 5 or 7

Intel Corporation • Phoenix (AZ)

Hybrid
USD 85,000 - 163,000
Stock bonuses
Health insurance
Retirement plan
+1
Module Engineer – Day Shift: Real-Time Floor Support
Module Engineer – Day Shift: Real-Time Floor Support

Intel • Phoenix (AZ)

On-site
USD 99,000 - 140,000
Stock bonuses
Health benefits
Vacation
+1
Advanced Packaging Module Engineer: Plating & Process Innovation
Advanced Packaging Module Engineer: Plating & Process Innovation

Intel Corporation • Hillsboro (OR)

On-site
USD 134,000 - 255,000
Stock bonuses
Health benefits
Retirement plan
+1
Module Engineer On Shift — 24x7 Semiconductor Packaging
Module Engineer On Shift — 24x7 Semiconductor Packaging

Intel Corporation • Phoenix (AZ)

Hybrid
USD 99,000 - 140,000
Stock bonuses
Health benefits
Retirement plan
+1
Night Shift Module Engineer – Packaging & Reliability
Night Shift Module Engineer – Packaging & Reliability

Intel Corporation • Phoenix (AZ)

On-site
USD 99,030 - 139,810
Stock bonuses
Health benefits
Retirement plan
+1
Night-Shift Module Engineer — Semiconductor Packaging
Night-Shift Module Engineer — Semiconductor Packaging

Intel Corporation • Chandler (AZ)

On-site
USD 99,000 - 140,000
Stock bonuses
Health benefits
Vacation
JR0283734 Module Engineer on Night Shift 6
JR0283734 Module Engineer on Night Shift 6

Intel Corporation • Phoenix (AZ)

On-site
USD 99,030 - 139,810
Stock bonuses
Health benefits
Retirement plan
+1
Lead Packaging Plating & Module Engineer
Lead Packaging Plating & Module Engineer

Intel Corporation • Oregon

On-site
USD 134,000 - 255,000
Competitive pay and stock bonuses
Health, retirement, and vacation benefi
Intel culture and growth opportunities