Memory Design Engineer – CMOS/DRAM (AI-Driven)

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical, dental, vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise, Idaho, seeks a Semiconductor Design Engineer to design, simulate, and optimize CMOS memory circuits for DRAM and emerging memory technologies, spanning from technology development to tape-out with global teams.

Responsibilities include interface with physical design, verification, and using FINESIM, HSPICE, and VERILOG. The role emphasizes analytical problem-solving, collaboration, and AI-assisted design workflows.

Qualifications

• Bachelor’s or Master’s degree in Electrical/Computer Engineering or related field.
• Foundational knowledge of CMOS circuit design and device physics.
• Experience with circuit simulation tools (FINESIM, HSPICE, SPICE, VERILOG).
• Understanding of digital logic, state machines, and verification methods.
• Strong communication and collaboration in a fast-paced engineering environment.

Responsibilities

• Design, simulate, analyze, and optimize CMOS memory circuits and blocks (memory arrays, control logic, datapaths, addressing).
• Support physical design activities including floor planning, placement, routing, and layout verification.
• Perform circuit simulations and debugging across operating conditions and targets.
• Collaborate with multi-functional teams to ensure product quality and tape-out success.
• Leverage AI-assisted design tools and automation to improve efficiency and productivity.

Skills

CMOS circuit design

Digital logic design

Analytical thinking

Written communication

Collaboration

Fast-paced engineering environment

Education

Bachelor’s or Master’s in Electrical/Computer Engineering

Tools

FINESIM

HSPICE

SPICE

VERILOG

Cadence Virtuoso

Job description

Micron Technology in Boise, Idaho, seeks a Semiconductor Design Engineer to design, simulate, and optimize CMOS memory circuits for DRAM and emerging memory technologies, spanning from technology development to tape-out with global teams.

Responsibilities include interface with physical design, verification, and using FINESIM, HSPICE, and VERILOG. The role emphasizes analytical problem-solving, collaboration, and AI-assisted design workflows.