Mechanical Engineer, Advanced Packaging (Semiconductor)

Advanced Micro Devices; San Jose (CA); On-site; USD 120,000 - 190,000; Full time

Job summary

Advanced Micro Devices (AMD) is seeking a hands-on mechanical engineer with semiconductor packaging experience to advance packaging solutions for AI, HPC, FPGA, ASIC, and SoC products. You will work with suppliers and manufacturing partners, driving designs from concept through production.

Strong mechanical design, CAD, and thermo-mechanical modeling skills are essential for this role in AMD’s advanced packaging team.

Qualifications

• Semiconductor packaging experience inside ASIC/SoC/HPC/CPU/GPU/AI environments.
• Strong CAD modeling, GD&T, tolerance analysis, DFM, and design reviews.
• Familiarity with thermo-mechanical modeling and chip-package interactions.

Responsibilities

• Develop advanced packaging solutions for AI, HPC, FPGA, ASIC, and SoC products.
• Lead mechanical design activities including CAD modeling, tolerance analysis, and DFM reviews.
• Collaborate with suppliers and contract manufacturers to ensure manufacturability.
• Review designs, simulations, drawings, and changes to maintain quality and manufacturability.
• Support thermo-mechanical modeling and package integration using Creo and ANSYS Mechanical.
• Contribute to chip, package, board, and system-level integration efforts.
• Partner with packaging, thermal, reliability, manufacturing, and supply-chain teams.
• Support development of next-gen packaging, cooling, and materials technologies.

Skills

Semiconductor packaging

Mechanical design

CAD modeling

GD&T

Tolerance analysis

DFM

Design reviews

Thermo-mechanical modeling

ANSYS Mechanical

Package integration

Supplier collaboration

Education

MS in Mechanical Engineering

PhD in related field

Tools

Creo

ANSYS Mechanical

Job description

Advanced Micro Devices (AMD) is seeking a hands-on mechanical engineer with semiconductor packaging experience to advance packaging solutions for AI, HPC, FPGA, ASIC, and SoC products. You will work with suppliers and manufacturing partners, driving designs from concept through production.

Strong mechanical design, CAD, and thermo-mechanical modeling skills are essential for this role in AMD’s advanced packaging team.