Sr Staff or Principal Thermal Engineer, Server Packaging (San Diego)

Qualcomm; San Diego (CA); Vor Ort; USD 180.400 - 270.600; Vollzeit

Benefits dieser Stelle

Discretionary annual bonus

RSU grants

Competitive benefits package

Zusammenfassung

Qualcomm Technologies, Inc. in San Diego, CA, is seeking a Senior Thermal Engineer to lead thermal architecture for high-performance server products.

You will drive CFD simulations from die to ambient, develop automation tools, and guide cross-functional teams through tradeoffs. The role requires an MS in Mechanical Engineering and 10+ years in electronics cooling for servers, with hands-on experience in TIM, heat sinks, vapor chambers, and packaging.

Qualifikationen

• MS in Mechanical Engineering is required.
• PhD in Mechanical Engineering is preferred.
• 10+ years of industry experience in electronics cooling for server products.
• Deep understanding of TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
• Experience with 2.5/3D packaging is highly desirable.
• Proficiency in Python, C/C++, MATLAB for data analysis and tool development.

Aufgaben

• Lead thermal architecture solutions through simulation and test while working with various stakeholders.
• Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase.
• Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
• Develop custom software solutions to automate thermal modeling and test.
• Conduct thermal tests to validate/characterize models and present results to stakeholders.
• Analyze and document simulation and test results.

Kenntnisse

Thermal design

CFD simulations

Python

C/C++

Matlab

2.5/3D packaging

Ausbildung

MS in Mechanical Engineering

PhD in Mechanical Engineering

Tools

ANSYS‑Icepak

Celsius EC

Jobbeschreibung

Company

Qualcomm Technologies, Inc.

Job Area

Engineering Group, Engineering Group > Packaging Engineering

General Summary

Qualcomm Data Center team is developing a high performance, energy efficient server solution for data center applications.

Key Responsibilities

• Lead thermal architecture solutions through simulation and test while working with various stakeholders.
• Perform thermal simulations utilizing CFD tools from silicon die to ambient throughout product development phase.
• Drive direction and strategy discussions, work cross-functionally with technical leads on tradeoffs, conduct thermal design reviews and presentations.
• Develop custom software solutions to automate thermal modeling and test.
• Conduct thermal tests to validate/characterize models and present results to stakeholders.
• Analyze and document simulation and test results.

Education

• Required: MS in Mechanical Engineering
• Preferred: PhD in Mechanical Engineering

Requirements

• 10+ years of industry experience in electronics cooling related to server products.
• Deep understanding of thermal management design elements including TIM, spreaders, heat sink, vapor chamber, heat pipe, and fan.
• Industry exposure to 2.5/3D packaging is highly desirable.
• Ability to write scripts in programming languages such as Python, C/C++, MATLAB, etc. for data analysis and tool development.
• Expertise in conducting CFD simulations and proficiency in software tools such as ANSYS‑Icepak and Celsius EC.
• Capability to design, execute thermal tests within a laboratory environment, and hands‑on experience with airflow and temperature measurements equipment.
• Some experience with 3D geometry CAD tools such as Solidworks or Creo is desirable.
• Excellent presentation, negotiation, and communication skills.
• Ability to clearly communicate complex technical content in written and verbal formats.
• Some experience with AI/ML concepts, algorithms, and methodologies is a plus.

Benefits

• Pay range: $180,400.00 – $270,600.00.
• Annual discretionary bonus program and opportunity for annual RSU grants.
• Competitive benefits package to support employees at work, at home, and at play.

EEO Information

Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.

Qualcomm is committed to providing an accessible process for individuals with a disability and will provide reasonable accommodations to support the application and hiring process.