Lead SoC Architect: Die-Scale & Multi-Chip

Volantis Semiconductor, Inc.; Boston (MA); On-site; USD 180,000 - 260,000; Full time

Job summary

Volantis Semiconductor, Inc. is seeking SoC architects to own the detailed SoC-level architecture of dies on wafer-scale systems. You will collaborate with architecture and ASIC design teams to draft specs and drive the execution of implementations.

The ideal candidate has proven ownership of at least one SoC/die, deep architecture–to–physical design understanding, and the ability to coordinate across multiple teams to deliver high-performance SoCs.

Qualifications

• Full ownership of specs and implementation for at least one SoC/die.
• Deep understanding of architecture, microarchitecture and physical design and ability to coordinate with various groups to drive implementation of SoCs.
• Ability to coordinate with packages, memory subsystems and IO blocks to drive SoC implementations.

Responsibilities

• Own the detailed SoC-level architecture and create implementable specs.
• Drive execution of SoC implementations with architecture and ASIC teams.

Skills

SoC architecture

die-level ownership

architecture coordination

microarchitecture understanding

physical design

memory subsystems

IO interfaces

multi-die design

reticle-max/large-die architecture

PPA optimization

high-speed silicon delivery

Job description

Volantis Semiconductor, Inc. is seeking SoC architects to own the detailed SoC-level architecture of dies on wafer-scale systems. You will collaborate with architecture and ASIC design teams to draft specs and drive the execution of implementations.

The ideal candidate has proven ownership of at least one SoC/die, deep architecture–to–physical design understanding, and the ability to coordinate across multiple teams to deliver high-performance SoCs.