Principal AI Systems Engineer - Semiconductor Innovation

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 120,000 - 190,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology in Boise, Idaho, is seeking a Senior Engineer to design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows.

You will architect agentic AI systems that integrate with modeling tools and fab/test platforms to enable digital twin development, translate complex results into actionable insights, and lead cross-functional collaboration across hardware and software teams.

Qualifications

• Bachelor's, Master's or PhD in Electrical Engineering, Computer Science, or related field.
• Experience building ML models on large diverse datasets and deploying AI/ML systems.
• Proficient with PyTorch or TensorFlow; experience with LLMs, RAG, and agentic workflows.

Responsibilities

• Design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor processes, packaging, and manufacturing workflows.
• Architect agentic AI systems that integrate with modeling tools, design automation environments, and fab/test platforms.
• Define and promote best practices for deploying LLMs and agentic systems in production with reliable performance.
• Translate modeling results into clear, actionable insights through data storytelling and visuals for technical and non-technical audiences.

Skills

Machine Learning

PyTorch

TensorFlow

LLMs

Data Modeling

Cloud Platforms

Education

Bachelor's/Master's/PhD in Electrical Engineering or Computer Science

Tools

AWS

GCP

Azure

PyTorch

TensorFlow

LLMs

Job description

Micron Technology in Boise, Idaho, is seeking a Senior Engineer to design and deploy physics-based, ML, and LLM-powered modeling solutions for semiconductor process, package, and manufacturing workflows.

You will architect agentic AI systems that integrate with modeling tools and fab/test platforms to enable digital twin development, translate complex results into actionable insights, and lead cross-functional collaboration across hardware and software teams.