Integrated Circuit - Packaging Architect Engineer

Socket.dev; San Jose (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

AMD is seeking a lead for advanced packaging technology to drive packaging architecture across client, server, gaming and GPU products. You will collaborate with product design teams to define a packaging roadmap including architecture, DFM and DFY guidelines, and lead initiatives from concept to qualification.

You will guide cross-functional teams across geos, communicate progress to executives, and partner with ecosystem players to analyze data and drive solutions for yield and reliability

Qualifications

• Proven track record in technology development leadership across architecture definition, process definition or yield improvement.
• Excellent oral and written communication to share complex signals with partners and management.
• Experience driving engineering teams in cross-functional, multi-geo environments.

Responsibilities

• Define package architectures and roadmaps with product architects and early definition teams.
• Lead new package technology development from concept to full technology qualification.
• Drive test vehicle design and manufacturing to establish design rules and DFM/DFY guidelines.
• Establish yield roadmap and lead implementation of yield and data analytic tools.

Skills

Leadership experience

Communication skills

Cross-functional collaboration

Education

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering

Tools

Data analytic tools

Job description

WHAT YOU DO AT AMD CHANGES EVERYTHING

At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career.

The Role:

Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.

The Person:

The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management.

Responsibilities:

• Work with product architects in early definition stage to understand and define package architectures, roadmap
• Lead new package technology development initiatives from concept to full technology qualification
• Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines
• Establish Yield roadmap and lead implementation of yield, data analytic tools as need

Preferred Experience:

• Experience in semiconductor technology development role
• Experience working with manufacturing partners such as suppliers, OSATs and foundry partners.
• In-depth knowledge in material science, thin film process development, and/or packaging
• Experience in a leadership role driving cross-functional teams
• Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment

Education:

BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent

This role is not eligible for visa sponsorship.

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Benefits offered are described: AMD benefits at a glance.

AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.