Lead Hardware Engineering Manager - Electronics Packaging

Lockheed Martin; Moorestown Township (NJ); On-site; USD 118,000 - 219,000; Full time

Benefits offered by this job

Medical insurance

401(k) match

Paid time off

Job summary

Lockheed Martin is seeking a First Line Manager for the Electronics Packaging group within the Sensors mechanical Design and Test organization. You will lead a team of about 20 engineers, drive hardware development processes, and oversee radar packaging designs to meet customer contracts and company standards.

The role requires a bachelor’s in mechanical engineering or related field, with extensive experience in electronics packaging, and the ability to obtain a SECRET clearance.

Qualifications

• Bachelor’s in Mechanical Engineering or related field.
• 7+ years in electronics packaging design.
• Knowledge of packaging techniques, materials, processes.
• Ability to lead cross-disciplinary teams and manage hardware lifecycle.
• Willingness to travel occasionally.
• Ability to obtain SECRET clearance.

Responsibilities

• Manage the research, design, development, and testing of COTS or custom computing hardware and/or other electrical components.
• Coordinate subordinate recruitment, training, performance assessment, and salary decisions.
• Oversee designs of PWB, CCA, electronic modules, and enclosures with documentation and analyses.
• Plan and direct preparation of project documentation to meet contract/requirements.
• Ensure preparation of specifications, vendor evaluations, and test report analyses.
• Provide technical, programmatic, and administrative leadership to ~20 engineers.
• Lead hardware development processes across multiple programs; coordinate with programs, manufacturing, SMEs, IRAD efforts.
• Oversee radar hardware design in the electronics packaging area.

Skills

Leadership

Electronics packaging

Hardware engineering processes

IRAD project management

Travel readiness

Education

Bachelor’s degree in Mechanical Engineering or related field

Master’s degree in Mechanical Engineering or related field

Tools

PWB design tools

Job description

Lockheed Martin is seeking a First Line Manager for the Electronics Packaging group within the Sensors mechanical Design and Test organization. You will lead a team of about 20 engineers, drive hardware development processes, and oversee radar packaging designs to meet customer contracts and company standards.

The role requires a bachelor’s in mechanical engineering or related field, with extensive experience in electronics packaging, and the ability to obtain a SECRET clearance.