Lead Aerospace Integration & Assembly Engineer - Aircraft Builds

Lockheed Martin; Palmdale (CA); On-site; USD 96,000 - 178,000; Full time

Benefits offered by this job

Medical, Dental, Vision

Flexible work arrangements

401(k) match

Paid time off

Holidays

Parental Leave

Education Assistance

Life Insurance

Short-Term Disability

Long-Term Disability

Job summary

Lockheed Martin in Palmdale, CA is seeking an Integration & Assembly Manufacturing Engineer to plan, prepare, and execute air-vehicle builds, testing and ground-support operations.

You will lead hardware integration, write build sequences, collaborate with design teams to ensure manufacturability, and resolve issues with root-cause analysis using iBASEt Solumina and 3DX/CATIA V5. Travel may be required.

Qualifications

• Ability to obtain Secret clearance within 8 months of submission.
• Engineering Degree required.
• Experience creating content using manufacturing and engineering software systems such as iBASEt (Solumina) and 3DX/CATIA V5.

Responsibilities

• Develop, implement, and refine hardware integration, assembly, manufacturing processes and build sequences.
• Collaborate with design engineering teams to ensure manufacturability and optimal use of equipment and methods.
• Identify and resolve issues related to hardware, tooling, process capability, and production inefficiencies through root cause analysis.
• Evaluate equipment and tool performance to verify efficiency and reliability.
• Respond to production issues and remove build constraints with ownership.
• Operate in a MBSE environment using 3DX and iBASEt Solumina to develop digital work instructions.

Skills

Technical aptitude

Initiative

Strategic thinking

Attention to detail

Collaboration

Education

Engineering degree

Tools

iBASEt Solumina

3DX/CATIA V5

PLM/ERP software

Job description

Lockheed Martin in Palmdale, CA is seeking an Integration & Assembly Manufacturing Engineer to plan, prepare, and execute air-vehicle builds, testing and ground-support operations.

You will lead hardware integration, write build sequences, collaborate with design teams to ensure manufacturability, and resolve issues with root-cause analysis using iBASEt Solumina and 3DX/CATIA V5. Travel may be required.