Lead, Advanced Packaging Process Integration

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 114,000 - 171,000; Full time

Benefits offered by this job

401k match

Medical, dental, vision

On-site fitness facility

Paid time off

Life insurance

Job summary

SkyWater Technology, Inc. Florida is seeking a seasoned Process Integration Engineer to lead the development of advanced packaging processes, including Si interposers, FanOut, and hybrid bonding.

You will drive end-to-end process flows, validate layouts with CAD, and collaborate with customers to deliver qualifying products ready for volume manufacturing. The role requires 7+ years in related semiconductor environments, strong problem-solving, and excellent communication skills to coordinate

Qualifications

• BS Engineering required; MS/PhD preferred.
• 7+ years in Process Development & Integration in Advanced Packaging or related semiconductor fab.
• Experience with FanOut wafer-level assembly and Hybrid Bonding.
• Knowledge of DOE, SPC, and Six Sigma concepts.

Responsibilities

• Transfer client package requests into a process flow using Si interposer, FanOut, and hybrid bonding.
• Develop and validate integrated Advanced Packaging process flows for multiple clients.
• Collaborate with CAD engineers to validate layouts and construct metrology frames.
• Lead cross-functional teams to deliver on schedule with high yield for qualification and transfer to volume manufacturing.
• Monitor process and tool interdependencies to improve device performance and yield.

Skills

Process development

Packaging expertise

DOE/SPC/6Sigma

Cross-functional communication

Problem solving

Project management

Independent work

Strong communication

Education

BS Engineering

MS/PhD preferred

Tools

DOE tools

SPC software

Job description

SkyWater Technology, Inc. Florida is seeking a seasoned Process Integration Engineer to lead the development of advanced packaging processes, including Si interposers, FanOut, and hybrid bonding.

You will drive end-to-end process flows, validate layouts with CAD, and collaborate with customers to deliver qualifying products ready for volume manufacturing. The role requires 7+ years in related semiconductor environments, strong problem-solving, and excellent communication skills to coordinate