Advanced Packaging Engineer: FanOut, Interposer & Quantum

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 159,000 - 238,000; Full time

Benefits offered by this job

401k match

Life insurance

Medical benefits

On-site fitness facility

On-site self-serve market

Paid time off

Paid holidays

Job summary

SkyWater Technology, Inc. in Florida is seeking an Advanced Packaging Development and Research Engineer to lead complex packaging programs, including wafer finishing, FanOut wafer level assembly, and hybrid bonding.

You will design, troubleshoot and scale processes while communicating across foundry teams and with customers. The role requires deep expertise in MEMS/Photonic/ HPC/ AI/ Quantum device integration, strong data-driven problem-solving, and collaboration with cross-functional teams.

Qualifications

• 12+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab environments.
• Experience with FanOut wafer level assembly, Quantum, Si Interposer and Hybrid Bonding.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Clear problem-solving ability, data driven and cross-functional teamwork.

Responsibilities

• Support prototype builds and wafer deliverables using Si interposer, FanOut and hybrid bonding processes.
• Characterize prototypes and processes with metrology and electrical analysis tools; document results.
• Coordinate failure analysis and interpret results across internal/external labs.
• Review, interpret and direct FEA needs and drive integration changes for performance/yield improvements.
• Create training materials and write technical papers to share state-of-the-art technologies.

Skills

Process development

Advanced packaging

DOE/SPC/6-sigma

Project management

Data-driven problem solving

Cross-functional teamwork

Education

BS Engineering

MS/PhD preferred

Tools

Metrology tools

FEA tools

Data analysis software

Advanced packaging tools knowledge

Job description

SkyWater Technology, Inc. in Florida is seeking an Advanced Packaging Development and Research Engineer to lead complex packaging programs, including wafer finishing, FanOut wafer level assembly, and hybrid bonding.

You will design, troubleshoot and scale processes while communicating across foundry teams and with customers. The role requires deep expertise in MEMS/Photonic/ HPC/ AI/ Quantum device integration, strong data-driven problem-solving, and collaboration with cross-functional teams.