Advanced Packaging Process Integration Engineer - Sr. Staff

SkyWater Technology, Inc.; Kissimmee (FL); On-site; USD 114,000 - 171,000; Full time

Benefits offered by this job

401k match

Medical, dental, vision

On-site fitness facility

Paid time off

Life insurance

Job summary

SkyWater Technology, Inc. Florida is seeking a seasoned Process Integration Engineer to lead the development of advanced packaging processes, including Si interposers, FanOut, and hybrid bonding.

You will drive end-to-end process flows, validate layouts with CAD, and collaborate with customers to deliver qualifying products ready for volume manufacturing. The role requires 7+ years in related semiconductor environments, strong problem-solving, and excellent communication skills to coordinate

Qualifications

• BS Engineering required; MS/PhD preferred.
• 7+ years in Process Development & Integration in Advanced Packaging or related semiconductor fab.
• Experience with FanOut wafer-level assembly and Hybrid Bonding.
• Knowledge of DOE, SPC, and Six Sigma concepts.

Responsibilities

• Transfer client package requests into a process flow using Si interposer, FanOut, and hybrid bonding.
• Develop and validate integrated Advanced Packaging process flows for multiple clients.
• Collaborate with CAD engineers to validate layouts and construct metrology frames.
• Lead cross-functional teams to deliver on schedule with high yield for qualification and transfer to volume manufacturing.
• Monitor process and tool interdependencies to improve device performance and yield.

Skills

Process development

Packaging expertise

DOE/SPC/6Sigma

Cross-functional communication

Problem solving

Project management

Independent work

Strong communication

Education

BS Engineering

MS/PhD preferred

Tools

DOE tools

SPC software

Job description

Bold Thinking. World Changing.

At SkyWater, our ingenuity helps improve lives around the world by manufacturing U.S. made semiconductors that are essential ingredients of modern life. Automotive safety enhancements, life-saving medical devices, consumer electronics and American security require semiconductors. Working in our Minnesota headquarters, Florida, or Texas location — employees join together to improve the world.

Explore what’s possible.

Joining our U.S. - based team means contributing to and learning about the commercialization of some of the most exciting technologies the world has ever seen. We are turning “science fiction” into everyday reality through technologies such as superconducting, 3D integrated circuits or computer chips, carbon nanotubes, photonic logic devices, micro electro-mechanical systems and other emerging device topologies. We manufacture products for aerospace and defense, medical, automotive, consumer and industrial markets, to name a few. Our customers include emerging leaders who rely on our intellectual property security and quality manufacturing services.

Step into the future.

SkyWater’s values of Integrity, Excellence, Collaboration, Empowerment and Growth Mindset guide us to cultivate an empowered, learning environment. We also invest in developing highly skilled, dedicated employees — and employees who are entering the workforce for the first time, from the military, and a variety of educational backgrounds.

Are you bold thinking?

Find your place on our team and help us change the world!

Position Summary

In the Advanced Packaging group at Skywater Florida, our team works hand in hand with customers to develop a wide range of exciting new, novel, and fully customized technologies - including Si interposers, FanOut and hybrid bonding. This is a unique opportunity to lead the development of new, novel technologies and leverage the advanced capabilities of our semiconductor fab to enable our customers to progress from idea/proof of concept through product qualification and transfer to volume manufacturing. We are looking for a hardworking, passionate and visionary Process Integration engineer to lead this effort. In this role, you will lead, develop, and improve an overall integrated Advanced Packaging process flow to deliver a qualified product to our foundry clients. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.

Major Area Of Accountability

• Transfer a client’s package requests into a process flow that utilizes Si interposer, FanOut and hybrid bonding manufacturing process flows. Identify areas that require development and lead the process team to deliver on schedule and with high yield a qualifiable final product. When required, lead task forces to identify root causes, correct and maintain product deliverables.
• Gain / utilize knowledge of the capabilities and interdependencies of tool sets within the process flow to create recipes that utilize temporary and permanent bonding, electrolytic / PVD metal deposition, dielectric deposition, photolithography, etch, CMP, bake, reflows, flip chip, wire bond tools.
• Process integration for a wide variety of clients that include MEMS / Photonics / High Performance Computing / CMOS / Memory / AI / Quantum devices
• Develop comprehensive process flows for wafer manufacturing, ensuring seamless execution.
• Collaborate with CAD engineers to validate incoming layout files, constructing frames with essential metrology boxes and electrical test structures.
• Integrate TSV first and / or TSV last process flows to enable Foundry client packages.
• Utilize metrology tools to characterize process conditions, identify root cause of any defects and document results.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process and tool engineers to find processing marginalities and make improvements.
• Liaise with the failure analysis lab to submit samples for cross-sectioning, contributing to continuous improvement.
• Routinely monitor selected in line and end of line SPC charts for trends or excursions that can be addressed by integration changes.
• Create quick turn cycles of learning to identify issues early and create a final product and process flow for Foundry clients.
• Incorporate, monitor and improve electrical test parametric to deliver an electrically good final package.
• Design and conduct experiments to validate and optimize process recipes.
• Monitor customer material and proactively address processing issues, ensuring a smooth workflow.
• Conduct regular meetings with customers, providing updates on project progress as materials move through the production line.
• Deliver process reviews with the goal of transitioning the device to full-scale production.

The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.

Required Qualifications

Education: BS Engineering, MS/PhD preferred

Experience And Skills

• 7+ years of Process Development & Integration Engineer experience in Advanced Packaging Fab or semiconductor fab environment related to FanOut wafer level assembly and Hybrid Bonding.
• Advanced Packaging Fab processing tools knowledge/experience.
• MEMS / Photonic / HPC / AI / ASIC / Quantum device and integration knowledge with relevant combination of years of experience and/or advanced degree.
• Knowledge of DOE, SPC, and 6-sigma concepts and applications.
• Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
• Exceptional oral and written communication skills.
• Ability to thrive in a large cross-functional program environment.
• Project Management skills and/or defined training a plus.
• Can work both independently and in cross-functional teams for problem solving.
• Strong organizational skills and work ethic.

U.S. Person Required

This position requires compliance with the International Traffic in Arms Regulations (ITAR). All accepted applicants must be U.S. Persons. ITAR defines a U.S. Person as U.S. citizen, U.S. Permanent Resident, Political Asylee, or Refugee.

#sw2

The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors, including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.

SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well as other employee financial benefits, including 401k match, and life insurance.

Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.

SkyWater complies with federal and state disability laws and makes reasonable accommodations for applicants and employees with disabilities unless doing so would cause an undue hardship. Alternative methods of applying for employment are available to individuals unable to submit an application through this site because of a disability. To request reasonable accommodations, to participate in the job application or interview process, to perform essential job functions, and/or to receive other benefits and privileges of employment, please contact Human Resources at 952-851-5200 or [e-mail].

EOE, including disability/vets

We will never ask applicants to pay fees, purchase equipment or gift cards, or provide financial information before a formal offer of employment has been accepted. If you receive a suspicious communication claiming to represent our company, please verify its authenticity by contacting our recruitment team at [e-mail] before responding.