Lead Semiconductor Package Development Engineer

Renesas Electronics; Austin (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Renesas Electronics in Austin, TX is seeking a Package Development Engineer to develop, qualify, and industrialize semiconductor package solutions that meet performance, reliability, manufacturability, cost, and schedule goals. You will collaborate with silicon design, package design, manufacturing, reliability, quality, and OSAT partners from concept through high-volume production.

The ideal candidate has hands-on packaging expertise, strong problem-solving skills, and the ability to lead

Qualifications

• Bachelor's degree in Packaging Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, Electrical Engineering, or a related technical discipline.
• Minimum 5+ years of experience in semiconductor package development, package integration, or advanced packaging technologies.
• Strong knowledge of semiconductor assembly processes, including wafer backgrind, wafer dicing, die attach, flip-chip assembly, wire bonding, underfill, encapsulation and molding, ball attach, package singulation, SMT.
• Experience developing and qualifying semiconductor packages in collaboration with OSAT partners.
• Knowledge of Design of Experiments (DOE), statistical analysis, and structured problem-solving methodologies.
• Experience conducting package reliability testing, failure analysis, and root-cause investigations.
• Strong analytical, project management, and communication skills.
• Ability to work independently and effectively within cross-functional global teams.

Responsibilities

• Develop, qualify, and industrialize semiconductor package solutions that meet performance, reliability, manufacturability, cost, and schedule requirements.
• Collaborate with cross-functional teams to bring new package technologies from concept through high-volume manufacturing.
• Drive complex technology development activities in a global environment.

Skills

Semiconductor packaging

DOE

Statistical analysis

Root-cause investigations

Cross-functional collaboration

Project management

Communication skills

Independent work

Education

Bachelor's degree in Packaging Engineering

Master's degree (preferred)

Ph.D. (preferred)

Job description

Renesas Electronics in Austin, TX is seeking a Package Development Engineer to develop, qualify, and industrialize semiconductor package solutions that meet performance, reliability, manufacturability, cost, and schedule goals. You will collaborate with silicon design, package design, manufacturing, reliability, quality, and OSAT partners from concept through high-volume production.

The ideal candidate has hands-on packaging expertise, strong problem-solving skills, and the ability to lead