Senior Semiconductor Package Development Engineer

Renesas; Austin (TX); On-site; USD 120,000 - 180,000; Full time

Job summary

Renesas is seeking a Package Development Engineer to develop, qualify and industrialize semiconductor package solutions with cross-functional teams including silicon design, package design, manufacturing, reliability, quality, and OSAT partners, bringing new package technologies from concept through high-volume manufacturing.

The ideal candidate combines strong packaging expertise with a hands-on, problem-solving mindset and the ability to drive complex technology development activities in a

Qualifications

• Bachelor's degree in Packaging Engineering or related field.
• 5+ years in semiconductor package development.
• Knowledge of semiconductor assembly processes (backgrind, dicing, die attach, flip-chip, wire bonding, underfill, encapsulation, ball attach, singulation, SMT).

Responsibilities

• Develop and qualify semiconductor package solutions from concept to high-volume manufacturing.
• Collaborate with OSAT partners and cross-functional teams.
• Lead design of experiments and root-cause investigations.

Skills

Semiconductor packaging

DOE

Statistical analysis

Root-cause analysis

Project management

Cross-functional leadership

Vendor management

Communication skills

Education

Bachelor's degree in Packaging Engineering or related field

Master's degree (preferred)

PhD (preferred)

Tools

Process characterization tools

Statistical analysis software (Minitab/JMP)

Job description

Renesas is seeking a Package Development Engineer to develop, qualify and industrialize semiconductor package solutions with cross-functional teams including silicon design, package design, manufacturing, reliability, quality, and OSAT partners, bringing new package technologies from concept through high-volume manufacturing.

The ideal candidate combines strong packaging expertise with a hands-on, problem-solving mindset and the ability to drive complex technology development activities in a