ATD Laser Development Engineer

Intel Corporation; Chandler (AZ); On-site; USD 85,000 - 163,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Arizona seeks a Packaging Module Development Engineer in Laser Assembly to shape the future of semiconductor packaging technologies. You will contribute to development of processes and equipment that ensure high performance and reliability across Intel's assembly and packaging solutions.

Collaborate with cross-functional teams to design laser assembly packaging processes, optimize manufacturing, set DOE-based specs, and drive standardization in qualification and quality

Qualifications

• Degree in Physics, Mechanical or Optical Engineering or related STEM field.
• Experience with SPC/DOE methods and data analysis basics.
• Understanding of laser/optical systems and their impact on packaging.

Responsibilities

• Design and develop laser assembly packaging processes and equipment.
• Optimize manufacturing to meet quality, cost, yield and productivity targets.
• Develop process specifications using DOE and data analysis.
• Oversee manufacturability of layout designs and packaging flows.
• Establish laser process specs and collaborate with suppliers.
• Innovate techniques and quality screens for early failure detection.
• Drive standardization in qualification procedures and quality systems.

Skills

SPC & DOE

Laser/Optical fundamentals

Cross-functional collaboration

Education

Bachelor’s degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

Master’s degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

Tools

Python

Numpy/Pandas

SQL

JMP

Minitab

Job description

Job Details:

Job Description:

The Role and Impact

Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies. This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation. Your work will directly impact the performance, quality, and reliability of Intel’s assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry. Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.

Key Responsibilities

• Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies.
• Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements.
• Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles.
• Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows.
• Establish laser process specifications and collaborate with suppliers to meet quality and performance standards.
• Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues.
• Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development.
• Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications

• Bachelor’s degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

• OR Master’s degree in Physics, Mechanical Engineering, Optical Engineering or related STEM field

Relevant experience should include the following:

• Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.

• Fundamental understanding of laser and optical systems

Preferred Qualifications

• Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems.
• Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly.
• Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects.
• Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.

We invite you to bring your expertise, creativity, and passion for technology innovation to Intel. Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape.

Job Type:

College Grad

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.