High-Frequency EM Modeling & Packaging Engineer

Texas Instruments; Dallas (TX); Sur place; USD 110 000 - 160 000; Plein temps

Résumé du poste

Texas Instruments Kilby Labs seeks an electromagnetic modeling engineer to support RF design for Silicon Photonics, RF filters and 2.5D/3D heterogeneous systems. You will work across ATD, packaging, chip design and test to deliver innovative, high-performance, cost-effective solutions.

Responsibilities include driving high-frequency interconnect simulations, building EM models for active and passive structures, and performing HFSS/EMX simulations with extracted S-parameters for circuit-level

Qualifications

• Experience in RF design and electromagnetics required.
• Ability to build and analyze EM models for RF passive structures.
• Familiarity with high-frequency interconnects and 2.5D/3D systems.

Responsabilités

• Drive high-frequency interconnect simulations for product developments.
• Lead electromagnetic modeling for advanced packages and 2.5D/3D systems.
• Build EM models of RF passive structures (filters, baluns, couplers).
• Perform HFSS and EMX simulations; analyze S-parameters for circuit-level work.
• Collaborate with ATD, packaging, chip design and test teams.

Connaissances

RF modeling

HFSS

EMX

RF simulations

3D integration

Outils

HFSS

EMX

Description du poste

Texas Instruments Kilby Labs seeks an electromagnetic modeling engineer to support RF design for Silicon Photonics, RF filters and 2.5D/3D heterogeneous systems. You will work across ATD, packaging, chip design and test to deliver innovative, high-performance, cost-effective solutions.

Responsibilities include driving high-frequency interconnect simulations, building EM models for active and passive structures, and performing HFSS/EMX simulations with extracted S-parameters for circuit-level