RF Electromagnetics & Packaging Design Engineer

Texas Instruments Incorporated

Dallas (TX)

On-site

USD 120,000 - 180,000

Full time

9 days ago

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Job summary

Kilby Labs within Texas Instruments Incorporated seeks an experienced electromagnetic modeling engineer to support RF product development, including silicon photonics, RF filters and 2.5D/3D heterogeneous systems. The role focuses on RF modeling of new technology platforms, working with ATD, packaging, chip design and test to deliver high-performance, cost-effective solutions.

The successful candidate will drive high-frequency interconnect simulations, build EM models of passive structures, and

Qualifications

Experience in RF modeling for high-frequency and high-speed interconnects.
Collaboration with process technology development, packaging, chip design and test teams.
Creative problem-solver capable of breakthrough solutions in RFEM/packaging domains.

Responsibilities

Drive and execute high-frequency interconnect simulations for TI product developments.
Lead electromagnetic modeling for advanced packages, TSVs, and 2.5D/3D systems.
Build and analyze EM models of RF passive structures (filters, baluns, couplers, interconnects).
Perform electromagnetic simulations using HFSS and EMX.
With extracted S-parameters, run circuit and system-level simulations.
Investigate RF interactions between circuits, package structures, and passives.
Draw mask layouts for test structures and support technology development.
Evaluate design trade-offs related to performance and manufacturability.