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Benefits offered by this job
Comprehensive medical and dental coverage
Employee stock purchase plan
Educational reimbursement
Job summary
Apple Inc. is seeking a Package Design Engineer in Los Angeles, California, to lead the physical design and integration of semiconductor packages. The role involves optimizing package architecture, collaborating with various teams, and employing AI tools for design efficiency. Candidates should have a BS with 10+ years in the industry and expertise in IC package design with tools like Cadence Allegro and Mentor Xpedition. Apple offers a competitive salary ranging from $171,600 to $302,200, alongside comprehensive benefits including stock options and reimbursement for educational expenses.
Qualifications
Proven experience in IC package physical design.
Strong understanding of high-speed interface layout constraints.
Familiarity with Unix/Linux environment and scripting languages.
Responsibilities
Perform physical layout of package substrates for silicon technologies.
Execute parasitic extraction and modeling for performance validation.
Collaborate with teams on package feasibility and design optimizations.
Skills
IC package physical design proficiency using Cadence Allegro
High-speed interface layout constraints knowledge
Automation and scripting skills in Python
Education
BS in relevant field with 10+ years industry experience
Tools
Cadence Allegro
Mentor Xpedition
HFSS and PowerSI
Job description
Apple Inc. is seeking a Package Design Engineer in Los Angeles, California, to lead the physical design and integration of semiconductor packages. The role involves optimizing package architecture, collaborating with various teams, and employing AI tools for design efficiency. Candidates should have a BS with 10+ years in the industry and expertise in IC package design with tools like Cadence Allegro and Mentor Xpedition. Apple offers a competitive salary ranging from $171,600 to $302,200, alongside comprehensive benefits including stock options and reimbursement for educational expenses.