IC Package Design Engineer: AI-Driven SoC/SiP

Apple Inc.; Austin (TX); On-site; USD 90,000 - 130,000; Full time

Job summary

Apple Inc. is seeking a Package Design Engineer in Austin, Texas to drive the design and integration of advanced semiconductor packages. You will lead physical design across various technologies, collaborating closely with cross-functional teams to enhance performance. The ideal candidate should have proficiency in Cadence Allegro or Mentor Xpedition and expertise in high-speed layout and Signal Integrity. The position emphasizes design methodology improvements and automation with scripting languages. Join a diverse team committed to inclusion and innovation.

Qualifications

• Proven experience in IC package physical design.
• Strong understanding of high-speed interface layout constraints and SI/PI analysis.
• Solid grasp of substrate manufacturing processes and DFM.
• Familiarity with Unix/Linux and scripting for automation.

Responsibilities

• Perform physical layout of package substrates for diverse silicon.
• Execute parasitic extraction and S-parameter modeling.
• Lead cross-functional collaboration on package feasibility.
• Drive package design methodology improvements by developing automated flows.

Skills

Package Design Proficiency

High-Speed & SI/PI Expertise

Manufacturing & Materials Knowledge

Automation & Scripting Skills

Tools

Cadence Allegro

Mentor Xpedition

HFSS

PowerSI

Calibre

CAM350

Python

Perl

TCL

Job description

Apple Inc. is seeking a Package Design Engineer in Austin, Texas to drive the design and integration of advanced semiconductor packages. You will lead physical design across various technologies, collaborating closely with cross-functional teams to enhance performance. The ideal candidate should have proficiency in Cadence Allegro or Mentor Xpedition and expertise in high-speed layout and Signal Integrity. The position emphasizes design methodology improvements and automation with scripting languages. Join a diverse team committed to inclusion and innovation.