Hybrid IC Package Design Engineer: BGA/WLP

Amkor Technology, Inc.; Tempe (AZ); Hybrid; USD 85,000 - 120,000; Full time

Job summary

Amkor Technology, Inc. in Tempe, Arizona, seeks an IC Package Design Engineer to develop high-quality laminate and wafer-level packages, create detailed drawings, and support multiple design activities across the Design Center.

You will collaborate with internal teams and customers to meet thermal, mechanical, electrical, and manufacturing requirements, prepare documentation, and drive continuous improvement in design methodologies.

Qualifications

• Bachelor's degree in Electrical or Mechanical Engineering.
• Experience using CAD software to create technical drawings.
• Strong verbal and written communication.
• Ability to manage multiple tasks with minimal supervision.
• Self-motivated, detail-oriented, and team-oriented.
• Proven ability to meet project deadlines in fast-paced environments.

Responsibilities

• Design laminate (BGA) and wafer-level packages meeting thermal, mechanical, and electrical requirements.
• Create accurate engineering drawings with minimal supervision.
• Analyze and resolve design challenges using engineering principles.
• Identify opportunities to improve design methodologies and processes.
• Collaborate with customers and cross-functional teams to support quality and productivity.
• Interface with customers for design reviews and project execution.
• Prepare technical documentation and maintain records.
• Demonstrate a continuous learning mindset and contribute to team knowledge sharing.

Skills

CAD software

Communication skills

Team collaboration

Project management

Education

Bachelor's degree in Electrical or Mechanical Engineering

Tools

Cadence APD

Cadence Sigrity

Siemens Expedition

Ansys HFSS

CAM350

Job description

Amkor Technology, Inc. in Tempe, Arizona, seeks an IC Package Design Engineer to develop high-quality laminate and wafer-level packages, create detailed drawings, and support multiple design activities across the Design Center.

You will collaborate with internal teams and customers to meet thermal, mechanical, electrical, and manufacturing requirements, prepare documentation, and drive continuous improvement in design methodologies.